Embedded Component Fabrication in Substrate Through Holes
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Solution Overview
Problem
Conventional methods for fabricating substrates with embedded components reduce wiring density and increase substrate thickness, failing to meet requirements for light weight, thinness, and smallness in electronic products.
Innovation Solution
A method involving a core layer with patterned circuit layers, a through hole for embedding components, and direct electrical connection of electrodes to inner circuit layers without plated through holes, using lithography, etching, and electroplating processes to enhance wiring density and reduce thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods use plated through holes to connect embedded components to surface circuits, then electrical connection is achieved, but wiring density is reduced and substrate thickness increases
Solution Approach 1:
The patent transitions from traditional two-dimensional surface mounting to three-dimensional embedding, placing components within the substrate thickness dimension. This allows electrical connections to be made through the substrate thickness rather than requiring extensive surface wiring, thereby increasing wiring density while maintaining connection reliability
Solution Approach 2:
The embedded component is nested within the substrate structure, specifically positioned in a cavity formed within the substrate thickness. This nesting approach allows the component to be integrated into the substrate's internal volume, reducing the need for surface space and increasing effective wiring density
2Reliability
If conventional methods use plated through holes for electrical connection, then embedded components are connected, but substrate thickness increases
Solution Approach 1:
The patent performs preliminary actions by forming the cavity and positioning the embedded component before completing the substrate lamination process. The cavity is created in a green sheet or pre-cured layer, allowing the component to be integrated into the substrate structure itself rather than requiring additional thickness for separate mounting layers
Solution Approach 2:
The patent merges the embedded component integration process with the substrate manufacturing process itself. The component is embedded during the lamination and curing process, combining what would traditionally be separate operations into a unified process that minimizes additional thickness
3Area of stationary object
If components are embedded in substrate, then wiring area on surface increases, but manufacturing complexity increases
Solution Approach 1:
The cavity for embedding the component is formed in advance during the substrate preparation stage, before final lamination. This preliminary cavity formation integrates smoothly with existing substrate manufacturing workflows, avoiding the need for complex post-processing steps while enabling increased surface wiring area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method increases wiring density and reliability of electrical connections while significantly reducing substrate thickness, aligning with design requirements for light weight, thinness, and smallness in electronic products.
Implementation Method 1
The patterned circuit layers are defined and formed through a lithography and etching process on copper foils
Data Source
AI summary
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit layer, and a second patterned circuit layer is provided. The first patterned circuit layer and the second patterned circuit layer are disposed on an upper surface and a lower surface of the first dielectric layer, respectively. Then, a through hole is formed in the core layer. Next, the core layer is arranged on a supporting board and an embedded component having at least one electrode is disposed in the through hole. Afterward, a process of filling glue is carried out, such that the embedded component is fixed in the through hole. Thereafter, the supporting board is removed. Finally, the electrode of the embedded component is electrically connected to the second patterned circuit layer.