Embedded Component Package with Varying Conductive Pillars
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Solution Overview
Problem
The warpage of embedded components during the semiconductor embedded in substrate (SESUB) technology complicates the manufacturing process by causing uneven electrical pads, making it difficult to form blind vias and reducing yield due to the sandblasting process, which either over-blasts or insufficiently blasts the vias.
Innovation Solution
The embedded component package structure incorporates conductive pillars with varying thicknesses and inclined angles to compensate for warpage, allowing these pillars to be exposed from the dielectric structure's surface, eliminating the need for blind vias formed by sandblasting and ensuring consistent heights for subsequent processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the embedded component is deformed due to warpage, then the electrical pads on the warped surface will not be on the same heights, but this increases the difficulty of the process for manufacturing subsequent conductive vias and reduces the yield of the process
Solution Approach 1:
The patent applies local quality by providing different thicknesses of conductive pillars at different locations to compensate for warpage. Specifically, the conductive pillars have a first thickness and a second thickness that are different from each other, allowing the higher pads to be reduced in height while maintaining the original height of lower pads, thereby achieving a substantially coplanar surface for subsequent processing
Solution Approach 2:
The patent changes the thickness parameter of conductive pillars to compensate for warpage-induced height variations. By adjusting the thickness of conductive pillars according to the warpage profile, the electrical pads are brought to substantially the same height, enabling consistent subsequent processing without over-blasting or insufficient blasting
2Ease of manufacture
If the sandblasting process is used to form conductive vias, then the vias can be formed in the dielectric structure, but the warpage causes the process to either over-blast or insufficiently blast the vias, damaging the embedded component or failing to form proper connections
Solution Approach 1:
The patent applies preliminary anti-action by pre-compensating for warpage through non-uniform conductive pillar thickness before the sandblasting process. This preliminary adjustment counteracts the warpage effect, ensuring that subsequent sandblasting forms conductive vias at the correct depth without over-blasting or insufficient blasting, thereby preventing damage to the embedded component
Solution Approach 2:
The patent performs preliminary action by establishing the correct height relationship among electrical pads through differential conductive pillar thickness before the via formation process. This preliminary height adjustment ensures that the sandblasting process can proceed with uniform parameters across the entire surface, forming proper conductive vias without requiring adaptive control
3Manufacturing precision
If the electrical pads are on uneven heights due to warpage, then the sandblasting process becomes difficult to control, but reducing the minimum dimension of electrical pads and spacing between them is needed for more precise connections
Solution Approach 1:
The patent applies local quality by providing different thicknesses of conductive pillars at different locations to compensate for warpage. Specifically, the conductive pillars have a first thickness and a second thickness that are different from each other, allowing the higher pads to be reduced in height while maintaining the original height of lower pads, thereby achieving a substantially coplanar surface for subsequent processing
Solution Approach 2:
The patent inverts the conventional approach by instead of trying to lift the lower pads to match higher pads, it reduces the height of higher pads through differential conductive pillar thickness. This inverted approach simplifies the manufacturing process by allowing uniform sandblasting parameters while achieving the desired coplanar surface
Data Source
AI summary
An embedded component package structure including a dielectric structure and a component is provided. The component is embedded in the dielectric structure and is provided with a plurality of conductive pillars. The conductive pillars are exposed from an upper surface of the dielectric structure and have a first thickness and a second thickness, respectively, and the first thickness is not equal to the second thickness.