Embedded Component Structure with Wrapping Conductive Terminals
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Solution Overview
Problem
Existing embedded electronic components on circuit boards face issues with excessive loss and reduced quality due to conventional contact connection designs, which limit flexibility and reliability, especially in three-dimensional structures.
Innovation Solution
The embedded component structure features misaligned electrical connection layers on a multilayer circuit board, with conductive terminals covering parts of the contacts' top surfaces and side walls, allowing for improved electrical connections and flexibility, and a staged dielectric layer removal process to prevent damage during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional contact connection designs are used above or below the electronic component, then the structure is simple, but excessive loss is generated and quality is reduced
Solution Approach 1:
The patent transitions from conventional two-dimensional contact connections (above or below the component) to a three-dimensional structure where conductive terminals wrap around the side walls of contacts. This dimensional change enables electrical connections at multiple spatial locations, reducing current path length and energy loss while improving product quality
2Adaptability or versatility
If conventional contact connection designs are used, then the manufacturing process is simple, but wiring flexibility on three-dimensional structure is limited
Solution Approach 1:
The conductive terminals are segmented into multiple portions that wrap around different sides of the contacts. This segmentation allows independent optimization of each terminal portion for specific wiring routes, enhancing three-dimensional wiring flexibility while maintaining manageable structural complexity through modular design
Solution Approach 2:
The invention adds vertical and lateral wrapping dimensions to contact connections, enabling wires to access contacts from multiple directions (top, bottom, sides) rather than only from above or below. This multi-directional access significantly improves wiring flexibility for three-dimensional structures
3Reliability
If dielectric layer is removed in one step to expose contacts, then the manufacturing process is short, but contacts may be damaged
Solution Approach 1:
The dielectric layer removal process is segmented into multiple steps: first removing a first portion to form blind holes, then removing a second portion to expand the holes and expose contacts. This staged approach distributes mechanical stress and allows intermediate inspections, preventing contact damage while maintaining reasonable process complexity
Solution Approach 2:
The first portion of the dielectric layer is removed in advance to create blind holes before the second portion is removed. This preliminary action allows for controlled exposure of contacts and enables intermediate process control measures, improving yield and reliability without significantly extending the overall manufacturing timeline
Data Source
AI summary
An embedded component structure includes a circuit board, an electronic component, a first conductive terminal, and a second conductive terminal. The circuit board includes a first electrical connection layer and a second electrical connection layer. The electronic component is embedded in the circuit board and includes a first contact and a second contact. The first conductive terminal and the second conductive terminal respectively at least cover a part of top surfaces and side walls of the first contact and the second contact, and the first electrical connection layer and the second electrical connection layer are respectively electrically connected to the first contact and the second contact through the first conductive terminal and the second conductive terminal. A method for manufacturing an embedded component structure is also provided.