3D Printing Embedded Electronic Components
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Solution Overview
Problem
The existing processes for embedding electronic components in PCBs are complex, time-consuming, and costly, with limitations on the number of components that can be integrated, requiring intensive equipment and separate packaging and silicon integration steps.
Innovation Solution
The use of 3D printing with additive processes to embed components directly into objects, allowing for rapid prototyping and manufacturing by combining techniques like conductive ink printing, laser drilling, and electroless/electrolytic plating, which enables solderless interconnections and integration of active and passive components in a single design process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional PCB embedding processes are used, then electronic components can be integrated into PCBs, but the process becomes complicated, time-consuming, and costly with multiple separate steps
Solution Approach 1:
The patent combines multiple separate manufacturing operations (PCB fabrication, component mounting, hole drilling, plating, and sealing) into a single integrated 3D printing process. The additive manufacturing system deposits material layer-by-layer to form the PCB substrate, embeds electronic components during printing, and creates protective enclosures all in one continuous operation, eliminating the need for separate packaging and assembly steps
Solution Approach 2:
The 3D printing system performs multiple functions simultaneously: it acts as a PCB fabricator, component placement machine, drilling and plating device, and enclosure manufacturer. This multi-functional approach allows a single device to complete what traditionally required multiple specialized machines and process steps
2Adaptability or versatility
If traditional package and silicon integration are performed at packaging facilities, then components can be integrated, but equipment costs become intensive and the number of integrable components is limited
Solution Approach 1:
The patent transitions from traditional planar PCB assembly to three-dimensional integrated structures using additive manufacturing. Electronic components are embedded within volumetric 3D-printed substrates and enclosures, allowing integration in multiple spatial dimensions rather than just on a flat surface. This enables unlimited component integration potential constrained only by design rather than equipment capabilities
3Reliability
If solder processes are used for component attachment, then electronic components can be connected to PCBs, but the process requires additional steps and potential harmful effects from soldering
Solution Approach 1:
The patent replaces traditional mechanical soldering processes with direct 3D printing attachment methods. Electronic components are bonded to the substrate through additive manufacturing material deposition and curing processes, eliminating the need for separate soldering operations. This substitution maintains connection reliability while simplifying the manufacturing process and removing harmful soldering steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of final products through a single integrated design and manufacturing process, reducing costs and time, allowing for rapid prototyping and fast manufacturing with the ability to create complex structures and protect circuitry with conformal coatings.
Implementation Method 1
additive printing on the one or more electronic components... a base layer is formed by using the additive printing... a base layer is formed by layer-by-layer printing
Implementation Method 2
forming a conductive path pattern... the conductive path pattern is formed by printing... the printing comprises using an electrically conductive ink
Implementation Method 3
laser drilling, mechanical drilling... forming one or more holes by the additive printing... forming holes by drilling
Implementation Method 4
electroless/electrolytic plating... depositing metals in the one or more holes
Implementation Method 5
electroless/electrolytic plating... depositing metals in the one or more holes
Implementation Method 6
the coupling comprises attaching using an adhesive
Data Source
AI summary
Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.