Embedded Microelectronic Components With Vertical Layout for Miniaturization

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Solution Overview

Problem

As electronic devices and systems become more complex, the increased circuit density in microelectronic devices leads to a reduction in size requirements, which is hindered by the standard sizes of electronic components occupying horizontal space and limiting the reduction of microelectronic devices.

Innovation Solution

The electronic components are vertically oriented within the substrate, with terminals extending in the vertical direction, reducing the lateral area occupied and allowing for thinner devices, while maintaining connections through conductive structures and caps for external connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If electronic components are arranged horizontally in the substrate, then the device can maintain standard component sizes and ease of manufacturing, but the horizontal area occupied increases, preventing further miniaturization of microelectronic devices

Engineering Contradiction:

Improvehorizontal area occupied by electronic componentsVSAvoidease of manufacturing

Core Design Contradiction:

Area of moving objectVSEase of manufacture

Solution Approach 1:

The patent applies vertical orientation of electronic components within the substrate, transitioning from traditional horizontal arrangement to three-dimensional configuration. This dimensional change allows components to extend in the vertical direction rather than occupying horizontal space, thereby reducing the footprint area while maintaining standard component sizes and manufacturing processes

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If the size of microelectronic devices is reduced to maintain similar sizes for associated electronic devices, then the circuit density increases, but the standard sizes of electronic components limit further size reduction

Engineering Contradiction:

Improvesize of microelectronic deviceVSAvoidadaptability to size reduction

Core Design Contradiction:

Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent enables further size reduction of microelectronic devices by orienting electronic components vertically within the substrate. This configuration allows the device footprint to be reduced while maintaining circuit functionality, as components extend vertically rather than horizontally, thus overcoming the limitation imposed by standard component sizes

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent embeds electronic components within the substrate structure, nesting them vertically between conductive structures. This nesting approach allows components to be integrated into the substrate's three-dimensional space, enabling compact device design and further miniaturization while maintaining adaptability

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS20260032823A1Microelectronic devices including embedded electronic components, and associated methods and systems

Publication Date: 2026.01.29 MICRON TECHNOLOGY INC

AI summary

A microelectronic device includes a substrate and at least one conductive structure in the substrate. The microelectronic device further includes an electronic component at least partially embedded in the substrate. The electronic component coupled to the at least one conductive structure at a first end of the electronic component and vertically extending between the at least one conductive structure and a surface of the substrate. The microelectronic device also includes a conductive cap coupling a second end of the electronic component to a second conductive structure on a first surface of the substrate.