Embedded Thermally Conductive Block for Z-Axis Heat Dissipation
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Solution Overview
Problem
Component carriers with embedded electronic components face challenges in efficient heat dissipation, particularly along the Z-axis, as existing methods primarily focus on heat dissipation in the X- and Y-axes, leading to inadequate thermal management and potential overheating.
Innovation Solution
A component carrier design featuring two stacked layer structures, with an embedded thermally conductive block and an electronic component, connected via a thermally conductive coupling medium to create a thermal path with a minimum conductivity of 7 W/mK, allowing efficient heat dissipation along the Z-axis without increasing the carrier's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If copper trace is applied to dissipate heat in the X-axis direction, then heat dissipation in the plane direction is improved, but heat dissipation in the Z-axis direction remains insufficient
Solution Approach 1:
The patent introduces a vertical thermal conduction path in the Z-axis direction by embedding a thermally conductive block that extends from the component interface through the substrate to the opposite surface. This adds a third dimension to heat dissipation, complementing the existing planar copper trace heat dissipation in the X-Y plane, thereby resolving the insufficient Z-axis heat dissipation without significantly increasing structural complexity.
2Volume of moving object
If embedded components are used to reduce size, then miniaturization is achieved, but heat generation increases and thermal management becomes more difficult
Solution Approach 1:
The patent addresses the heat generation issue of embedded components by creating a vertical heat dissipation pathway through the substrate in the Z-axis direction. The thermally conductive block provides a direct thermal conduction path from the embedded component to the opposite surface, enabling heat to escape in three dimensions rather than being confined to the two-dimensional plane, thus managing heat effectively in miniaturized structures.
Solution Approach 2:
The patent employs a composite thermal management structure combining copper traces in the substrate plane with a vertically extending thermally conductive block. This composite approach integrates different thermal conduction mechanisms (planar conduction through copper traces and vertical conduction through the block) to efficiently manage heat from embedded components while maintaining the compact size.
3Productivity
If more electronic components are mounted with smaller spacing, then functionality increases, but heat density increases and thermal management becomes challenging
Solution Approach 1:
The patent introduces vertical thermal conduction through the substrate in the Z-axis direction to handle the increased heat density from high-component-density arrangements. The thermally conductive block provides a dedicated heat escape route perpendicular to the component plane, allowing heat from densely packed components to be efficiently removed without relying solely on planar heat spreading, thus enabling higher productivity while managing thermal challenges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables effective thermal management and heat dissipation along the Z-axis, preventing overheating while maintaining mechanical robustness and electrical reliability, even under harsh conditions.
Implementation Method 1
a thermal path (in particular an entire thermal path), that extends from the embedded component via the (embedded) thermally conductive block (up or down, respectively) to an exterior (main) surface of the component carrier, has a minimum thermal conductivity of at least 7 W/mK
Data Source
AI summary
A component carrier includes i) a first layer stack having a first electrically conductive layer structure and/or at least one first electrically insulating layer structure, ii) a component embedded in the first layer stack, iii) a second layer stack having at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and iv) a thermally conductive block embedded in the second layer stack. Hereby, the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK, in particular at least 40 W/mK. Further, a method of manufacturing the component carrier is described.