Embedded Conductive Circuits in Heat-Dissipating Substrates
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Solution Overview
Problem
Current heat-dissipating substrate structures require an external wire bonding process, which can lead to inadequate bonding force and increased volume and space, reducing reliability.
Innovation Solution
A heat-dissipating substrate structure with built-in conductive circuits, featuring an electrically insulating layer enclosing and contacting the side walls of metal layers, with conductive circuits extending through and being embedded within the insulating layer, eliminating the need for external wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external wire bonding process is used to form electrical connection, then electrical connection can be established, but bonding force is inadequate and reliability is reduced
Solution Approach 1:
The patent merges the electrical connection function with the existing metal layer structure by forming conductive circuits within the insulating layer that connects metal layers directly, eliminating the need for separate external wire bonding processes and integrating multiple functions into a unified structure
Solution Approach 2:
The patent extracts the wire bonding process from the manufacturing sequence and replaces it with built-in conductive circuits that are formed during the substrate fabrication process, removing the external bonding step entirely and improving reliability by eliminating the bonding interface
2Reliability
If external wire bonding process is used, then electrical connection is formed, but overall volume and occupied space are increased
Solution Approach 1:
The conductive circuits are nested within the insulating layer structure, with the circuits embedded in the insulating material between metal layers, utilizing the existing substrate volume efficiently and eliminating the need for additional external wire bonding space
Solution Approach 2:
The patent transitions from external wire bonding (three-dimensional external connection) to internal conductive circuits (two-dimensional planar integration within the substrate), reducing the overall volume by utilizing the existing layer structure in the vertical dimension
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances reliability by eliminating the reliability issues associated with wire bonding and reduces the overall volume and space occupied by eliminating the need for external wire bonding.
Implementation Method 1
The first metal layer and the second metal layer are connected to the heat-dissipating layer, respectively, through a first thermally conductive and electrically insulating layer and a second thermally conductive and electrically insulating layer
Implementation Method 2
at least one of the conductive circuits extends through at least one of the side wall of the first metal layer and the side wall of the second metal layer and is embedded in the electrically insulating layer
Implementation Method 3
the first metal layer and the second metal layer are each connected to the heat-dissipating layer by sintering
Data Source
AI summary
A heat-dissipating substrate structure with built-in conductive circuits is provided. The heat-dissipating substrate structure includes an electrically insulating layer, a first metal layer, a second metal layer, and a heat-dissipating layer. The first metal layer and the second metal layer are disposed on the heat-dissipating layer at an interval. The electrically insulating layer encloses and is in contact with side walls of the first metal layer and side walls of the second metal layer, such that a top wall of the first metal layer and a top wall of the second metal layer are exposed from the electrically insulating layer, and at least one of the conductive circuits extends through at least one of the side wall of the first metal layer and the side wall of the second metal layer and is embedded in the electrically insulating layer.