Embedded Conductive Coin for Thermal Dissipation in IC Substrates
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Solution Overview
Problem
Conventional embedded component packaging in IC devices faces challenges with thermal management, limited to low power applications due to inefficiencies in dissipated power management, particularly in designs using thermal vias or solid copper masses.
Innovation Solution
Incorporating a conductive coin, such as a copper coin, within the substrate core to eliminate the need for additional vias and enhance thermal and electrical conductivity, allowing for improved heat transfer and signal transmission through the vertical thickness of the coin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal vias or solid copper masses are used for power management, then thermal dissipation is achieved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The conductive coin merges multiple functions into a single component: it serves as both a thermal via for heat dissipation and an electrical conductor for power delivery. This eliminates the need for separate thermal vias and copper masses, reducing structural complexity while maintaining thermal management effectiveness.
Solution Approach 2:
The conductive coin performs multiple functions simultaneously: thermal conduction for heat dissipation, electrical conduction for power delivery, and mechanical support for embedding circuit components. This multi-functionality reduces the overall complexity of the power management system.
2Reliability
If additional vias are used to connect conductive layers, then electrical connectivity is achieved, but manufacturing complexity increases
Solution Approach 1:
The conductive coin is embedded in the starter core before subsequent manufacturing steps, establishing pre-formed conductive pathways that eliminate the need for later via formation. This preliminary action simplifies subsequent manufacturing processes while ensuring reliable electrical connectivity.
Solution Approach 2:
The patent extracts the via formation step from the manufacturing process by using a pre-formed conductive coin that provides direct electrical connectivity. This removes the complex via drilling and plating steps while maintaining reliable electrical connections between conductive layers.
3Volume of moving object
If embedded component packaging is used, then miniaturization is achieved, but thermal management becomes more difficult
Solution Approach 1:
The conductive coin provides localized thermal conduction pathways directly at the heat generation points within the embedded components. This localized approach to thermal management is more effective in miniaturized structures where heat dissipation pathways must be precisely targeted and optimized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more effective thermal management and electrical connectivity, expanding the use of embedded component packaging to higher power applications while simplifying manufacturing processes.
Implementation Method 1
the coin may allow (a) heat transfer from the embedded circuit component to the respective conductive layer
Implementation Method 2
the coin may allow (b) communication of electrical signals between the embedded circuit and the respective conductive layer
Data Source
AI summary
A substrate (e.g., a printed circuit board) for use in an integrated circuit package includes a first dielectric layer, a conductive coin embedded in the first dielectric layer, a first conductive layer formed on a first side of the first dielectric layer, a cavity in the first conductive layer, the cavity located over the conductive coin, and an embedded circuit component arranged in the cavity in the first conductive layer, wherein the embedded circuit component is located over the conductive coin and conductively coupled to the conductive coin. The substrate also includes a second dielectric layer formed over the first conductive layer, a second conductive layer formed over the second dielectric layer, and a via extending through the second dielectric layer, the via electrically connecting the second conductive layer to the embedded circuit component.