Embedded Conductive Element for RF Signal Path Optimization
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Solution Overview
Problem
Existing electronic devices face challenges in transmitting and processing radiofrequency signals at high frequencies due to the long resistive paths formed by electrical connection networks and elements, which affect antenna dimensions and signal quality.
Innovation Solution
The electronic device incorporates an additional electrically conductive element with a main portion extending parallel to the support plate and a secondary portion linked to the chip or support plate, embedded in the encapsulation block, which can form a radiofrequency antenna, reducing signal path length and improving quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electrical connection networks and elements are used to transmit radiofrequency signals, then the device structure is simple and easy to manufacture, but the signal transmission path becomes very long and resistive, reducing signal quality at high frequencies
Solution Approach 1:
The conductive element is divided into a main portion extending parallel to the support plate and a secondary portion linking to the chip, creating segmented signal paths that reduce overall resistance and length while maintaining electrical connectivity
Solution Approach 2:
The conductive element transitions from traditional planar connections to a three-dimensional configuration embedded in the encapsulation block, with portions extending parallel to the support plate and folding back to connect to the chip, effectively reducing signal path length through spatial optimization
2Volume of moving object
If antenna dimensions are reduced for high frequency operation, then the device becomes more compact, but signal transmission quality deteriorates due to the small size and long resistive paths
Solution Approach 1:
The conductive element is strategically positioned and configured within the encapsulation block to create optimal local electromagnetic fields for antenna operation, with specific portions folded back to achieve resonant structures that maintain effectiveness at reduced dimensions
Solution Approach 2:
The antenna structure utilizes three-dimensional space within the encapsulation block rather than traditional planar layouts, allowing compact dimensions while maintaining effective radiating elements through vertical and lateral extensions
3Reliability
If the conductive element is embedded deep in the encapsulation block to reduce path length, then signal quality improves, but the fabrication process becomes more complex
Solution Approach 1:
The conductive element is pre-formed with its main and secondary portions configured before embedding, allowing precise positioning and connection to chip contacts before the encapsulation process, thereby simplifying the overall fabrication sequence
Solution Approach 2:
The conductive element is nested within the encapsulation block structure, with the main portion extending parallel to the support plate and the secondary portion nested to connect to chip contacts, creating a compact integrated structure that simplifies assembly
Data Source
AI summary
An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.