Embedded Conductive Patterning for Transparent EMI Shields
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for forming electrically conductive patterns on substrates, such as antennas or EMI shields, often require photolithography, which is costly and difficult to implement, and struggle with achieving high aspect ratios and optical transparency while maintaining high electrical conductance.
Innovation Solution
A process involving a unitary polymeric layer with conductive elements embedded, where the conductive elements are connected via busbars that can be later disconnected to isolate them, allowing for the formation of patterns with high aspect ratios and optical transparency using a conductive seed layer and metallic bodies, and the use of a tool with raised portions to create cavities for conductive material deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography is used to form conductive patterns, then manufacturing precision can be achieved, but production cost and process complexity increase significantly
Solution Approach 1:
The patent extracts the conductive pattern formation process from the complex photolithography sequence by using a stamping tool with raised portions that directly imprint conductive material onto the substrate. This eliminates multiple photolithography steps (photoresist coating, exposure, development, etching) while maintaining pattern precision through the physical stamp structure.
Solution Approach 2:
The patent uses a stamping tool that acts as a physical copy or template of the desired conductive pattern. The raised portions of the stamp create cavities in the polymeric layer that define the conductive element geometry, replicating the pattern without requiring photolithographic imaging processes.
2Illumination intensity
If traditional photolithography methods are used, then conductive patterns can be formed, but optical transparency and high aspect ratios are difficult to achieve
Solution Approach 1:
The patent transitions from planar photolithographic patterning to three-dimensional stamping by creating cavities with depth in the polymeric layer. The raised portions of the stamp extend into the substrate, forming cavities that hold conductive material at controlled depths, enabling high aspect ratios while maintaining optical transparency through precise depth control.
Solution Approach 2:
The patent applies different properties to different regions: the polymeric layer provides optical transparency in regions without conductive material, while the stamped cavities with conductive filling provide high electrical conductance and structural definition. This local differentiation allows simultaneous optimization of optical and electrical properties.
3Illumination intensity
If conductive elements are embedded in polymeric layer, then optical transparency improves, but electrical conductance may be compromised
Solution Approach 1:
The patent creates a composite structure where a polymeric layer (optically transparent) is combined with conductive material (electrically conductive) in stamped cavities. The polymeric layer maintains optical transparency while the conductive material filling the cavities provides the necessary electrical conductance, with the composite achieving both properties simultaneously.
Solution Approach 2:
The conductive material is nested within the cavities formed in the polymeric layer. This nesting allows the conductive elements to be embedded within the transparent polymeric matrix, maintaining optical transparency while providing electrical conductance through the nested conductive structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the creation of patterned articles with high optical transparency and electrical conductance, suitable for applications like antennas and EMI shields, while reducing production costs and complexity compared to traditional photolithography methods.
Implementation Method 1
a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer
Implementation Method 2
one or more busbars extending along the second direction and embedded at least partially in the unitary polymeric layer
Data Source
AI summary
A patterned article includes a unitary polymeric layer and a plurality of electrically conductive elements embedded at least partially in the unitary polymeric layer. Each electrically conductive element includes a conductive seed layer having a top major surface and an opposite bottom major surface in direct contact with the unitary polymeric layer, and includes a metallic body disposed on the top major surface of the conductive seed layer. The metallic body has a bottom major surface and at least one sidewall. The bottom major surface contacts the conductive seed layer. Each sidewall is in direct contact with the unitary polymeric layer and extends from the bottom major surface of the metallic body toward or to, but not past, a top major surface of the unitary polymeric layer. The conductive elements may be electrically isolated from one another. Processes for making the patterned article are described.