Embedded Conductor Substrate Printing for Precise Wiring Harness Assembly
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Solution Overview
Problem
Existing methods for manufacturing assemblies with embedded conductors lack precision in locating and integrating conductors within substrates, requiring human intervention and limiting automation in assembly and installation processes.
Innovation Solution
An automated additive manufacturing process using 3D printing or similar techniques to form a substrate with embedded conductors, where the substrate defines precise location features and apertures for conductor exposure, enabling robotic assembly and installation by precisely locating conductors relative to these features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing methods are used for assemblies with embedded conductors, then human intervention is required for conductor placement, but this reduces manufacturing precision and increases complexity
Solution Approach 1:
The patent combines the substrate manufacturing process with the conductor embedding process into a single integrated additive manufacturing operation. The conductors are deposited simultaneously with the substrate material through the same printing head, eliminating the need for separate conductor placement operations and human intervention. This merging of processes achieves precise conductor placement while reducing overall process complexity.
Solution Approach 2:
The additive manufacturing system automatically performs conductor placement without human intervention. The system self-regulates the deposition of conductive material, positioning, and embedding within the substrate through automated control of the printing head movement and material extrusion, eliminating the need for manual operations.
2Productivity
If traditional manufacturing methods are used, then manual assembly is required, but this reduces productivity and increases time consumption
Solution Approach 1:
The additive manufacturing process enables continuous deposition of both substrate material and embedded conductors in a single uninterrupted operation. The printing head continuously moves along the predetermined path, extruding material without stopping for separate conductor placement steps, thereby maximizing productivity and minimizing manufacturing cycle time.
Solution Approach 2:
The conductor paths and positions are pre-programmed into the additive manufacturing process before production begins. The system automatically follows the predetermined path and deposits conductors at the correct locations during substrate formation, eliminating the need for time-consuming manual measurement and placement operations during assembly.
3Measurement precision
If automated processes are implemented, then efficiency increases, but precision in locating conductors relative to substrate features may be compromised
Solution Approach 1:
The additive manufacturing system incorporates real-time feedback control through sensors that monitor the printing head position, material flow rate, and substrate formation progress. This feedback enables the automated system to maintain high precision in conductor location relative to substrate features by continuously adjusting parameters during the manufacturing process.
Solution Approach 2:
The patent replaces manual mechanical positioning operations with automated computer-controlled movement of the printing head. The system uses digital models and programmed paths to determine conductor locations, substituting human-operated mechanical systems with automated computational control that achieves higher precision and consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates robotic assembly and installation of wiring harnesses, reducing human error and increasing efficiency by ensuring precise conductor placement and connection, while allowing for varied conductor types and configurations.
Implementation Method 1
An automated additive manufacturing process using 3D printing or similar techniques to form a substrate with embedded conductors
Data Source
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AI summary
An apparatus (200) includes an electronic controller (214) having a memory device and an extruding device (202) connected to the electronic controller (214). The extruding device (202) has a dispensing head (204) configured to dispense a dielectric material though an orifice (206) in the dispensing head (204) as commanded by the electronic controller (214). A wire feed device (208) is connected to the electronic controller (214) and the extruding device (202) and is configured to feed a conductive wire (102) through the orifice (206) as commanded by the electronic controller (214). A cutting device (210) is connected to the electronic controller (214) and the extruding device (202). The cutting device (210) severs the wire (102) after it is fed through the orifice (206) as commanded by the electronic controller (214). An electromechanical device (212) is connected to the electronic controller (214) and to the extruding device (202). The electromechanical device (212) is configured to move the extruding device (202), the wire feed device (208), and the cutting device (210) within a 3D space as commanded by the electronic controller (214).