Embedded Controller Die in Substrate Cavity for Semiconductor Packages

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Solution Overview

Problem

Conventional semiconductor packages face challenges in efficiently connecting controller dies to substrates due to the large size of memory dies and the resulting long wire bonds, which slow down device operation and complicate assembly.

Innovation Solution

A semiconductor device fabrication process where a cavity is formed in the substrate to mount the controller die, allowing for shorter, more efficient electrical connections using printed conductive traces or flexible films, and enabling the stacking of memory dies without obstructing the controller die's bond pads.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the controller die is placed at the top of the memory die stack, then the package footprint is minimized, but the wire bond length increases and operation speed decreases

Engineering Contradiction:

Improvepackage footprintVSAvoidoperation speed

Core Design Contradiction:

Area of stationary objectVSSpeed

Solution Approach 1:

The patent transitions from a vertical stacking arrangement to a planar integration approach where the controller die is mounted on the same substrate as the memory dies. This dimensional change eliminates the need for long vertical wire bonds while maintaining a compact package footprint through efficient substrate layout.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Length of moving object

If the controller die is mounted directly on the substrate, then wire bond length is reduced, but mounting the larger memory die on top becomes difficult

Engineering Contradiction:

Improvewire bond lengthVSAvoidassembly ease

Core Design Contradiction:

Length of moving objectVSEase of manufacture

Solution Approach 1:

The substrate serves multiple functions: it provides the mounting platform for the controller die, the electrical interconnection network through conductive traces, and the structural base for mounting memory dies. This multi-functionality eliminates the need for separate interposer layers while simplifying the assembly process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Quantity of substance

If memory die size is increased to boost capacity, then storage capacity increases, but the controller die becomes relatively smaller and harder to connect

Engineering Contradiction:

Improvememory capacityVSAvoidconnection complexity

Core Design Contradiction:

Quantity of substanceVSDevice complexity

Solution Approach 1:

The substrate acts as an intermediary platform that provides a common reference plane and electrical network for both the large memory dies and the smaller controller die. The conductive traces on the substrate serve as the mediation mechanism for electrical connections, simplifying the interface between components of different sizes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS9236368B2Semiconductor device including embedded controller die and method of making same

Publication Date: 2016.01.12 SANDISK TECHNOLOGIES LLC

AI summary

A semiconductor device includes a substrate (102) with a cavity (112) formed therein for receiving a semiconductor die. In examples, the semiconductor die is a controller die (114). The controller die (114) may be electrically connected to the substrate (102) with electrical traces (120) which may be formed for example by printing. After the controller die (114) is electrically connected to the substrate (102), one or more memory die (150) may be affixed to the substrate (102), over the cavity (112) and controller die (114).