Embedded Cooling Channels and Cold Plates for High-Power Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current air cooling methods for high-power electronics are limited in heat removal capacity and require continuous mechanical assistance, which strains systems and consumes additional power, making them inefficient for consistent and rapid cooling.
Innovation Solution
A fluid cooling system with embedded channels in a top portion and parallel inlet and outlet fluid conduits in a bottom portion, allowing for continuous removal of high-temperature coolant and introduction of fresh coolant for consistent heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling methods are used for high-power electronics, then the system structure is simple, but the heat removal capacity is limited and cooling rate is gradual
Solution Approach 1:
The patent replaces air cooling with liquid cooling by introducing a fluid cooling system with channels that circulate coolant directly across the heat-generating surface. The coolant absorbs heat through thermal conduction and convection, achieving superior heat removal capacity compared to air cooling while maintaining system simplicity.
Solution Approach 2:
The patent eliminates the need for mechanical fans by using natural convection currents driven by temperature differences. The heated coolant rises and is replaced by cooler coolant, creating a continuous circulation loop without mechanical assistance, thus removing the fan strain and power consumption issues.
2Reliability
If fans are operated continuously to maintain consistent cooling, then the cooling effectiveness is improved, but power consumption increases and fan strain increases
Solution Approach 1:
The patent employs periodic natural convection cycles where heated coolant rises and cooler coolant replaces it continuously. This periodic flow pattern maintains consistent cooling without requiring continuous mechanical operation, thereby reducing power consumption and eliminating fan strain while ensuring reliable heat removal.
3Use of energy by moving object
If air cooling is used, then the system power consumption is lower, but the cooling rate is gradual and insufficient for rapid cooling requirements
Solution Approach 1:
The patent uses liquid coolant instead of air, which has superior thermal conductivity and heat capacity. The fluid channels are positioned in direct contact with the heat-generating surface, enabling rapid heat transfer through conduction and convection, achieving fast cooling rates without increasing power consumption since no mechanical fans are required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables efficient and consistent heat removal from high-power electronics, extending their operational lifespan by maintaining optimal temperatures without the need for continuous mechanical cooling.
Implementation Method 1
a first surface contacting the package... a plurality of embedded channels formed on a second surface positioned opposite the first surface
Implementation Method 2
the outlet fluid conduits are connected to the outlet sections, which allow for high-temperature coolant to be constantly removed from the system
Implementation Method 3
outlet sections, which allow for high-temperature coolant to be constantly removed from the system
Implementation Method 4
move fresh water in to the system to continuously remove heat
Data Source
AI summary
Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).