Embedded Cooling Channels in Power Electronics Assemblies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat sinks fail to adequately manage heat in power electronics due to increased heat flux, leading to elevated operating temperatures and additional thermal resistance from bonding layers and materials.
Innovation Solution
Integration of a semiconductor fluid channel system within power electronics assemblies, featuring a substrate layer with inlet and outlet ports and metallization layers along the inner surfaces of semiconductor fluid channels, allowing for direct circulation of dielectric cooling fluid to enhance heat removal and reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks are used to remove heat from power electronics, then heat removal capability is limited, but thermal resistance increases due to additional bonding layers and thermal interface materials
Solution Approach 1:
The patent merges the cooling function directly into the semiconductor device by integrating fluid channels within the device structure itself, eliminating the need for separate heat sinks and thermal interface materials. This integration removes additional thermal resistance layers while maintaining effective heat removal from the heat-generating regions.
2Power
If power electronics operate at increased power levels, then electrical performance improves, but heat flux increases making thermal management challenging
Solution Approach 1:
The patent transitions from conventional external cooling to internal cooling by embedding fluid channels within the semiconductor device structure. This dimensional integration allows heat to be removed directly at the source through channels positioned within the heat-generating regions, enabling effective thermal management at increased power levels.
3Loss of energy
If additional bonding layers and thermal interface materials are added to conventional heat sinks, then heat removal capability is enhanced, but thermal resistance increases substantially
Solution Approach 1:
The patent extracts and eliminates the unnecessary bonding layers and thermal interface materials from the conventional heat sink configuration. By integrating cooling channels directly within the semiconductor device, the design removes these intermediate thermal resistance layers while maintaining effective heat removal capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated fluid channel system effectively lowers thermal resistance and maintains or improves electrical performance by directly addressing heat removal at the semiconductor device, while reducing electrical on-resistance and enhancing cooling efficiency.
Implementation Method 1
Cooling fluid may be used to receive heat generated by the heat generating device by convective thermal transfer
Implementation Method 2
a fluid channel metallization layer positioned along the inner surface of the semiconductor fluid channel
Data Source
AI summary
A power electronics assembly having a semiconductor device that includes a first device surface opposite a second device surface, a semiconductor substrate layer that extends from the first device surface to a substrate-drift interface, a semiconductor drift layer that extends from the substrate-drift interface towards the second device surface, and a semiconductor fluid channel is positioned within the semiconductor substrate layer of the semiconductor device. Further, the semiconductor fluid channel includes an inner surface. Moreover, a fluid channel metallization layer is positioned along the inner surface of the semiconductor fluid channel.