Embedded Cooling Manifold Layout for Multi-Chip Thermal Resistance
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Solution Overview
Problem
Existing cooling systems for multi-chip and multi-cold-plate device packages face inefficiencies due to high thermal resistance at interfacial boundaries and cumulative thermal resistance along heat transfer paths, leading to reduced cooling efficiency and increased energy consumption.
Innovation Solution
The integration of direct bonding and hybrid bonding techniques between semiconductor devices and cold plates, along with embedded cooling assemblies, reduces thermal resistance by eliminating intervening adhesives and optimizing heat transfer paths through coolant channels and chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface materials are used to facilitate heat transfer between chip and heat dissipation device, then thermal coupling is enhanced, but thermal resistance at interfacial boundaries increases
Solution Approach 1:
The patent removes the thermal interface material from the heat transfer path between the cold plate and heat dissipation device. By directly bonding the cold plate to the heat dissipation device through eutectic bonding or other direct bonding techniques, the intervening TIM layer is eliminated, thereby removing its thermal resistance while maintaining reliable thermal coupling through strong direct bonds.
Solution Approach 2:
The patent merges the cold plate and heat dissipation device into a single integrated structure through direct bonding. This eliminates the separate TIM layer and creates a unified thermal path, reducing cumulative thermal resistance while maintaining structural integrity and thermal coupling through the bonded interface.
2Power
If multiple cold plates are used in multi-chip device packages to combat increased heat production, then heat dissipation capacity is improved, but system complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent cold plates, each dedicated to a specific chip. This segmentation allows each cold plate to be optimized for its associated chip's thermal requirements while maintaining modular simplicity in the overall system architecture and manufacturing process.
Solution Approach 2:
The patent creates a universal manifold structure that can serve multiple cold plates simultaneously. This single manifold design provides coolant distribution to all cold plates through a standardized interface, reducing overall system complexity despite the presence of multiple cold plates by using a shared, multi-functional distribution system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency, reducing thermal resistance and energy consumption while maintaining optimal operating temperatures for semiconductor devices.
Implementation Method 1
heat transfer paths between a first semiconductor device and a first cold plate, and between a second semiconductor device and a second cold plate
Implementation Method 2
coolant channels and chambers
Implementation Method 3
In some embodiments, the first cold plate is directly bonded to a backside surface of the first semiconductor device, and the second cold plate is directly bonded to a backside surface of the second semiconductor device
Data Source
AI summary
A device package comprising a cooling system. The cooling system comprises a first substrate, a first semiconductor device located on a first region of the first substrate, a second semiconductor device located on a second region of the first substrate, a first cold plate attached to the first semiconductor device, a second cold plate attached to the second semiconductor device, and a manifold having a first chamber volume and a second chamber volume. The first chamber volume comprises a first inlet coupled to a first coolant line, a first outlet coupled to the first cold plate, and a second outlet coupled to the second cold plate. The second chamber volume comprises a third outlet coupled to a second coolant line, a second inlet coupled to the first cold plate, and a third inlet coupled to the second cold plate.