Embedded Coplanar Waveguide Fixture for Air-Gap-Free Thin-Film Testing

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Solution Overview

Problem

Existing methods for characterizing thin dielectric materials and thin films face challenges due to complex and expensive setups, unreliable measurements, and inaccurate results caused by air gaps in coplanar waveguides, which affect electromagnetic wave propagation and material characterization.

Innovation Solution

An embedded coplanar waveguide (E-CPW) system is designed with a superstrate layer filling gaps between conductor layers to ensure flat placement of materials, eliminating air gaps and improving measurement accuracy by using connectors to conduct RF signals and applying Nicholson-Ross Weir analytical formulas for permittivity extraction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional coplanar waveguide fixtures are used for thin-film characterization, then measurement setups can be established, but air gaps form between traces and ground conductors causing measurement distortion and inaccurate material characterization

Engineering Contradiction:
Improvematerial characterization accuracyVSAvoidmeasurement distortion from air gaps
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

A superstrate layer is introduced as an intermediary component between the signal trace and the upper ground conductors. This superstrate layer fills the air gaps and provides a continuous dielectric medium, eliminating the harmful air gaps that cause measurement distortion while enabling accurate electromagnetic wave propagation through the thin-film material under test.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the physical state and distribution of the dielectric medium by replacing air gaps with a solid superstrate layer. This parameter change eliminates the discontinuities in the electromagnetic path, ensuring consistent wave propagation and accurate material characterization across the measurement frequency range.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If thin-film materials are characterized using conventional measurement systems, then characterization can be performed, but the thin and flexible nature of materials causes unreliable measurements due to insufficient electromagnetic wave interaction

Engineering Contradiction:
Improvemeasurement reliabilityVSAvoidamount of material for EM wave interaction
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The invention embeds the coplanar waveguide structure within a multi-layer construction, transitioning from a conventional surface-mounted fixture to an embedded configuration. The signal trace is positioned between lower and upper ground conductors with a superstrate layer, creating a three-dimensional electromagnetic environment that enhances wave-material interaction despite the thinness of the material under test.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The thin-film material under test is nested within the embedded coplanar waveguide structure, positioned between the superstrate layer and the lower conductor layer. This nesting arrangement ensures the material is fully contained within the electromagnetic field region, maximizing interaction between the electromagnetic waves and the thin-film material for reliable characterization.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Measurement precision

If complex measurement setups like Terahertz Spectroscopic or Rectangular Waveguides are used, then electrical characterization of thin dielectric materials can be attempted, but the setups become complex and expensive

Engineering Contradiction:
Improveelectrical characterization capabilityVSAvoidmeasurement setup complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The embedded coplanar waveguide fixture is designed as a universal measurement platform that can characterize various thin-film and paint materials across broad millimeter-wave frequency ranges. The standardized multi-layer structure with configurable material pockets accommodates different material types and thicknesses, eliminating the need for multiple specialized fixtures and reducing overall system complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The E-CPW system provides accurate permittivity and loss tangent estimation for thin films and paints by eliminating air gaps, enabling reliable and cost-effective characterization in broad millimeter wave frequency bands.

Implementation Method 1

The electromagnetic wave does not propagate through enough material to experience significant and measurable interaction within the sample, and air gaps between traces and ground conductors of the CPW fixture may result in inaccurate material characterization due to measurement distortion

Methodology Applied
Scientific EffectElectromagnetic wave propagation:

Implementation Method 2

applying Nicholson-Ross Weir analytical formulas for permittivity extraction

Methodology Applied
Scientific EffectPermittivity extraction: Dielectric Permittivity

Data Source

PatentUS12580292B2Embedded coplanar waveguides for thin-film material characterization and methods related to the same
Publication Date: 2026.03.17 GM GLOBAL TECHNOLOGY OPERATIONS LLC
  • US12580292B2 patent drawing
  • US12580292B2 patent drawing
  • US12580292B2 patent drawing

AI summary

A thin-film material measurement and characterization fixture system using an embedded coplanar waveguide fixture including a substrate layer, an upper conductor layer disposed on top of the substrate layer, the upper conductor layer including a first upper conductor layer and a second upper conductor layer spaced from the first upper conductor layer by a gap, a signal trace disposed on top of the substrate layer in the gap between the first upper conductor layer and the second upper conductor layer, and a superstrate layer disposed on top of the upper conductor layer and the signal trace, the superstrate layer filling the gap between the first upper conductor layer and the second upper conductor layer to achieve accurate thin-film characterization in the millimeter wave bands.