Embedded Coupled Inductor Layout for Low-Loss Package Voltage Regulation
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Solution Overview
Problem
Existing voltage regulation systems in high-performance computing applications face challenges in miniaturization and efficiency due to the size and performance limitations of inductors, necessitating optimal power delivery networks that minimize interconnection losses and operate each processor core at optimal voltage and frequency.
Innovation Solution
The integration of a coupled inductor within a substrate core, comprising a double clad laminate with patterned metal layers and multilayered magnetic core layers, enhances voltage regulation efficiency and miniaturization by enabling smaller footprint topologies with higher current handling and lower current ripple.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional inductors are used for voltage regulation, then voltage regulation function is achieved, but inductor size and interconnection losses increase
Solution Approach 1:
The patent merges the inductor with the substrate core by embedding the inductor structure directly into the substrate during manufacturing. The inductor windings are formed using metal layers integrated into the substrate stack, eliminating the need for separate inductor components and reducing interconnection losses between discrete components.
Solution Approach 2:
The inductor structure is nested within the substrate core architecture. The double-clad laminate with metal layers is sandwiched between magnetic core layers, creating a compact nested structure where the inductor is contained within the substrate volume rather than occupying separate space.
2Volume of moving object
If inductor miniaturization is pursued, then smaller footprint is achieved, but current handling capability and voltage regulation efficiency deteriorate
Solution Approach 1:
The patent uses composite magnetic core layers made from magnetic materials with specific properties to maintain high current handling capability in a miniaturized structure. The double-clad laminate combines dielectric and conductive materials to optimize both size and electrical performance for efficient voltage regulation.
Solution Approach 2:
The inductor design transitions from planar windings to a three-dimensional nested structure with magnetic core layers sandwiching the double-clad laminate. This vertical stacking in the Z-dimension enables higher current handling capability while maintaining a small footprint by utilizing volumetric space efficiently.
3Loss of energy
If voltage regulation is moved near the load, then interconnection losses are reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The voltage regulation function is merged with the substrate structure by integrating the inductor directly into the substrate core. This combination eliminates the need for separate voltage regulation modules and complex interconnections, reducing both energy losses and manufacturing complexity through a unified integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coupled inductor design achieves improved voltage regulation efficiency and current handling capabilities, reducing current ripple and enabling smaller, more efficient power delivery networks for high-performance computing applications.
Implementation Method 1
first and second magnetic core layers sandwiching the double clad laminate. Each of the first and second magnetic core layers may comprise a multilayered core including at least two magnetic films
Implementation Method 2
The first and second metal layers may be patterned to define spiral windings
Data Source
AI summary
A package substrate for a semiconductor device includes a substrate core and a coupled inductor embedded in the substrate core. The coupled inductor may include a double clad laminate having a dielectric layer and first and second metal layers sandwiching the dielectric layer. The first and second metal layers may be patterned to define spiral windings. The coupled inductor may further include first and second magnetic core layers sandwiching the double clad laminate. Alternatively, the coupled inductor may include a magnetic core embedded in a dielectric substrate and first and second conductive windings surrounding the magnetic core. Each of the first and second conductive windings may include one or more first segments defined by metal patterning in a plane parallel to the magnetic core and one or more second segments defined by one or more conductive vias extending through the magnetic core or through dielectric surrounding the magnetic core.