Embedded Coupled Inductor Structure for Compact Voltage Regulation
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Solution Overview
Problem
Existing voltage regulation systems in high-performance computing applications face challenges in miniaturization and efficiency due to the size and performance limitations of inductors, which affect processor core operation and power delivery networks.
Innovation Solution
The integration of a coupled inductor within a substrate core using a double clad laminate and multilayered magnetic core layers, comprising materials like CoNiFe, NiFe, and SiFe, enhances inductance and current handling capabilities, allowing for smaller footprint and higher efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional inductors are used for voltage regulation, then voltage regulation function is achieved, but inductor size is large and occupies excessive substrate area
Solution Approach 1:
The inductor is embedded within the substrate core structure, nesting the passive component inside the substrate rather than placing it on the surface. This nesting approach significantly reduces the footprint area while maintaining the inductor's functional performance for voltage regulation
Solution Approach 2:
The inductor design transitions from planar spiral windings to a three-dimensional structure with magnetic core layers stacked in multiple levels. This dimensional change from 2D to 3D allows achieving the required inductance value in a smaller planar area by utilizing vertical space
2Area of stationary object
If inductor size is reduced for miniaturization, then substrate area is reduced, but inductance and current handling capabilities deteriorate
Solution Approach 1:
The inductor employs composite magnetic core layers made of different magnetic materials (ferrite, nickel-zinc, manganese-zinc) with distinct permeability and loss characteristics. This composite structure enables the miniaturized inductor to maintain high inductance and current handling by optimizing magnetic flux distribution and reducing core losses
Solution Approach 2:
The magnetic core layers are pre-configured with specific permeability values and thicknesses during manufacturing to ensure the inductor achieves the required inductance and current handling capabilities before being integrated into the substrate. This preliminary optimization of magnetic properties compensates for the reduced size
3Volume of moving object
If inductor size is reduced, then device miniaturization is achieved, but manufacturing complexity increases
Solution Approach 1:
The inductor is segmented into discrete manufacturable components: double-clad laminate layers with metal traces, separate magnetic core layers, and dielectric materials. Each segment can be manufactured independently using standard PCB and magnetic component fabrication processes, then assembled through lamination, reducing overall manufacturing complexity despite the miniaturized 3D structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coupled inductor design achieves improved voltage regulation efficiency, reduced current ripple, and higher current handling, enabling optimal processor operation with minimal losses.
Implementation Method 1
Each of the first and second magnetic core layers may comprise a multilayered core including at least two magnetic films with adhesive therebetween. In each of the first and second magnetic core layers, the at least two magnetic films may include at least one material selected from the group consisting of CoNiFe, NiFe, and SiFe.
Implementation Method 2
The first and second metal layers may be patterned to define spiral windings. The coupled inductor may comprise a double clad laminate including a dielectric layer and first and second metal layers sandwiching the dielectric layer.
Data Source
AI summary
A package substrate for a semiconductor device includes a substrate core and a coupled inductor embedded in the substrate core. The coupled inductor may include a double clad laminate having a dielectric layer and first and second metal layers sandwiching the dielectric layer. The first and second metal layers may be patterned to define spiral windings. The coupled inductor may further include first and second magnetic core layers sandwiching the double clad laminate. Alternatively, the coupled inductor may include a magnetic core embedded in a dielectric substrate and first and second conductive windings surrounding the magnetic core. Each of the first and second conductive windings may include one or more first segments defined by metal patterning in a plane parallel to the magnetic core and one or more second segments defined by one or more conductive vias extending through the magnetic core or through dielectric surrounding the magnetic core.