Embedded Crack Arrest Structure for IC Package Dicing Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer dicing methods often result in chipping or cracking of die edges, particularly when cutting through brittle low-k dielectrics, leading to potential rupture of die seals and reduced die lifetime due to crack propagation from scribe lanes.
Innovation Solution
Incorporating crack arrest structures (CAS) between scribe lanes, which provide an additional barrier to prevent crack propagation and absorb crack energy, thereby reducing damage during the dicing process and protecting the die seals from moisture-induced damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional dicing methods are used to separate individual dies, then manufacturing efficiency is maintained, but crack propagation and die seal rupture occur reducing reliability
Solution Approach 1:
A crack arrest structure is introduced as an intermediary element between adjacent scribe lanes. This structure acts as a mediator that intercepts and arrests cracks before they can propagate to the die seal, thereby protecting die integrity without interfering with the dicing process efficiency
Solution Approach 2:
The scribe lane region is segmented by introducing a crack arrest structure that divides the continuous scribe lane into separate zones. This segmentation prevents crack propagation across the entire scribe lane width, stopping cracks at the arrest structure while maintaining the functional separation of dies
2Ease of operation
If scribe lanes are made wider to accommodate dicing, then cutting accessibility is improved, but crack propagation distance increases
Solution Approach 1:
The crack arrest structure serves as an intermediary barrier within the scribe lane that blocks crack propagation. This allows the scribe lane to maintain sufficient width for saw blade accessibility while the arrest structure prevents cracks from traveling the full width of the lane to reach the die seal
3Measurement precision
If multiple scribe lanes are added for electrical testing, then wafer conformance verification is improved, but crack arrest capability is reduced
Solution Approach 1:
Each scribe lane is independently segmented by crack arrest structures, creating discrete arrest zones. This segmentation ensures that even with multiple scribe lanes present for electrical testing, each lane's crack propagation is independently arrested, maintaining overall reliability while allowing comprehensive electrical verification
Data Source
AI summary
A system, method, and apparatus for suppressing cracks in the wafer dicing process. A wafer includes a plurality of die attached to a frame and mounting tape, with the die separated by a plurality of scribe lanes. An existing die seal generally protects the boundary of the die but can still fail to fully protect the die from excessive cracks induced by dicing damage, particularly when dicing through brittle, low-k dielectrics. The system, method, and apparatus includes embedding a crack arrest structure (CAS) between adjacent scribe lanes. Upon a mechanical saw dicing the wafer, the CAS creates a moisture diffusion block, and can absorb or significantly diminish the energy of cracks propagating towards the individual die seals. Furthermore, the system, method, and apparatus can be implemented without the need to increase the width of the scribe lanes.