Embedded DC Blocking Capacitors in Substrate Cavities
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Solution Overview
Problem
High-speed serial links face challenges in minimizing board space usage and reducing cross-talk and signal reflections due to the need for additional components and vias to connect DC blocking capacitors in semiconductor packages.
Innovation Solution
The method involves positioning DC blocking capacitors within existing openings in the substrate, such as through holes, and using non-conductive materials to fix their orientation, eliminating the need for extra space and reducing discontinuities, thereby minimizing cross-talk and signal reflections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If DC blocking capacitors are connected using additional components and vias in conventional methods, then the electrical connection between semiconductor devices is established, but the board space usage increases and cross-talk and signal reflections increase
Solution Approach 1:
The patent merges the DC blocking capacitor with the substrate by embedding the capacitor directly into the substrate structure. This integration eliminates the need for separate mounting components and additional vias, thereby reducing board space usage and minimizing discontinuities that cause cross-talk and signal reflections in high-speed serial links
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical connection pathways, and housing for the DC blocking capacitor. By making the substrate multi-functional and embedding the capacitor within it, the design eliminates the need for separate component mounting areas, thus reducing overall board space and improving signal integrity
2Productivity
If DC blocking capacitors are embedded within the substrate using existing openings, then the density of semiconductor packages increases and PCB size is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent performs preliminary actions by forming openings in the substrate before final assembly, and by pre-embedding the DC blocking capacitors into these openings during substrate fabrication. This advance preparation allows for more efficient subsequent assembly processes and enables higher package density without significantly complicating the overall manufacturing workflow
Solution Approach 2:
The DC blocking capacitor is nested within the substrate structure, specifically placed inside existing openings or vias of the substrate. This nesting approach maximizes space utilization, increases package density, and reduces the need for additional external components, thereby shrinking PCB size while maintaining manufacturability through integrated fabrication processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases the density of semiconductor packages, reduces the size and cost of PCBs, and enhances high-speed serial link performance by minimizing parasitic losses and signal path length.
Implementation Method 1
filling the cavity in the support structure with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material
Data Source
AI summary
An apparatus includes a cavity formed in a support structure, the support structure being operable to support a semiconductor device. A circuit element is disposed in the cavity in the support structure, and the cavity in the support structure is filled with an electrically non-conductive filling material so as to at least partially surround the circuit element with the non-conductive filling material. The semiconductor device is electrically connected to the circuit element. In an example embodiment, the circuit element is operable to substantially block direct current that is output by the semiconductor device or another semiconductor device.