Embedded PCB DC-DC Converter Layout for Lower Parasitic Loss
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Solution Overview
Problem
Existing DC-DC converters suffer from parasitic losses and inefficiencies due to non-ideal components and arrangements, leading to a need for improved power conversion solutions.
Innovation Solution
A direct current to direct current (DC-DC) power converter is designed with embedded circuitry between two printed circuit board (PCB) parts, featuring a pulse width modulator, switches, and an inductor with vias electrically coupled to the inductor and circuitry, optimizing switching rates and reducing parasitic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional DC-DC converter components and arrangements are used, then the converter can be manufactured with conventional processes, but parasitic losses and inefficiencies occur
Solution Approach 1:
The patent merges the inductor and circuitry into a single integrated converter component, eliminating separate discrete components and their associated parasitic losses. The inductor is formed as an integrated structure with the circuitry layers, reducing inter-component parasitic inductance and resistance while maintaining conventional manufacturing processes.
Solution Approach 2:
The circuitry is nested within or around the inductor structure, with conductive paths formed through vias and traces that are integrated into the inductor's magnetic core or surrounding structure. This nesting arrangement minimizes the distance between components and reduces parasitic effects while keeping the overall structure manufacturable with standard PCB techniques.
2Area of stationary object
If the converter footprint is reduced, then space is saved in electronic systems, but component integration becomes more difficult
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional vertical structure by stacking conductive layers, vias, and inductor windings in multiple levels. This vertical integration dramatically reduces the footprint area while maintaining manufacturability through conventional multi-layer PCB processes and automated assembly techniques.
Solution Approach 2:
The circuitry components are nested within the vertical profile of the inductor structure, with conductive paths routed through vias and traces that occupy the same horizontal footprint. This nesting approach packs maximum functionality into minimal area while using standard manufacturing processes for multi-layer circuits.
3Productivity
If switching rate is increased, then power conversion efficiency improves, but parasitic effects increase
Solution Approach 1:
By merging the switching circuitry and inductor into a single integrated structure with minimal interconnect distance, the patent reduces parasitic inductance and resistance that would otherwise limit switching rate. The integrated design allows faster switching transitions by minimizing the loop area and trace length between switching elements and the inductor.
Solution Approach 2:
The patent optimizes the geometric parameters of the integrated structure, such as trace width, via diameter, and layer spacing, to minimize parasitic effects at high switching frequencies. The inductor's magnetic core material and winding configuration are also optimized to maintain low losses at elevated switching rates while keeping the structure manufacturable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher efficiency and switching speeds, reduces the converter's footprint, and minimizes parasitic effects, leading to improved performance and compact design in electronic systems.
Implementation Method 1
an inductor positioned over the top side of the upper PCB part, wherein the one or more vias are electrically coupled to the inductor and to the embedded circuitry
Implementation Method 2
embedded circuitry that is between the top side of the lower PCB part and the bottom side of the upper PCB part, the embedded circuitry comprising: a pulse width modulator; and at least one switch
Data Source
AI summary
A direct current to direct current (DC-DC) converter can include a chip embedded integrated circuit (IC), one or more switches, and an inductor. The IC can be embedded in a PCB. The IC can include driver, switches, and PWM controller. The IC and/or switches can include eGaN. The inductor can be stacked above the IC and/or switches, reducing an overall footprint. One or more capacitors can also be stacked above the IC and/or switches. Vias can couple the inductor and/or capacitors to the IC (e.g., to the switches). The DC-DC converter can offer better transient performance, have lower ripples, or use fewer capacitors. Parasitic effects that prevent efficient, higher switching speeds are reduced. The inductor size and overall footprint can be reduced. Multiple inductor arrangements can improve performance. Various feedback systems can be used, such as a ripple generator in a constant on or off time modulation circuit.