Embedded Debonding Control for Selective Adhesive Disassembly
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Solution Overview
Problem
Existing methods for disassembling adhesive members using thermal means result in wasted energy and potential damage to non-adhesive components, and lack efficient control over the disassembly process.
Innovation Solution
A debonding apparatus and system that includes a debonder and a controller, capable of using solvents, heat, or light to selectively target and debond adhesive members within an object, with authentication and remote control features to ensure efficient and secure disassembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If thermal means are used to heat the entire object to debond the adhesive member, then the adhesive member can be effectively heated and debonded, but energy is wasted heating parts other than the adhesive member and deterioration of non-adhesive parts may occur
Solution Approach 1:
The patent embeds debonders (heating elements) directly at the adhesive member location within the fastener assembly, enabling localized heating only where needed rather than heating the entire fastened structure. This resolves the contradiction by concentrating thermal energy precisely at the adhesive interface, eliminating energy waste and protecting non-adhesive parts from thermal deterioration.
Solution Approach 2:
The heating system is segmented into multiple independent debonders distributed at different adhesive locations within the fastener. Each debonder operates independently to heat only its local adhesive region, avoiding the need to heat the entire object and thereby reducing energy consumption and preventing damage to non-target areas.
2Productivity
If thermal means are used to heat the entire object to debond the adhesive member, then the adhesive member can be effectively heated and debonded, but the heating process is inefficient due to energy waste
Solution Approach 1:
By placing debonders directly at the adhesive locations within the fastener assembly, the system achieves efficient localized heating that directly targets the adhesive member without wasting energy on surrounding structures. This improves debonding productivity while minimizing energy loss.
Solution Approach 2:
The debonders act as intermediary heating elements embedded within the fastener structure itself, enabling direct thermal transfer to the adhesive member without requiring external heating of the entire object. This intermediary approach enhances heating efficiency and reduces energy waste.
3Reliability
If authentication is implemented to prevent unauthorized disassembly, then security is improved, but the device complexity increases
Solution Approach 1:
The fastener assembly performs authentication autonomously through embedded sensors and controllers that automatically verify authorization signals without requiring external authentication hardware or manual verification processes. This self-service approach enhances security while minimizing additional device complexity.
Solution Approach 2:
The authentication functionality is merged with the existing debonder control system, combining security verification and heating control into a single integrated controller. This reduces overall device complexity by eliminating separate authentication hardware while maintaining security functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves high-efficiency debonding with reduced energy waste and enhanced security by targeting adhesive members precisely, preventing unauthorized disassembly.
Implementation Method 1
the debonder may include a heat source configured to apply heat to the adhesive member
Implementation Method 2
the debonder may include a container containing a solvent that can dissolve the adhesive member
Implementation Method 3
the debonder may include a light source configured to apply light to the adhesive member
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
A debonding apparatus (20) includes a debonder (26) and a controller (21) that are located inside an object including multiple adhered members (51, 52) adhered by an adhesive member (53). The debonder (26) is configured to be operatable to debond the adhesive member (53) by acting on the adhesive member (53). The controller (21) is configured to activate the debonder (26), based on a debonding instruction received from a terminal apparatus (10) located outside the object.