Embedded Decoupling Capacitor Wiring Board via Laser Via
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Solution Overview
Problem
The existing methods for embedding decoupling capacitors in wiring boards face challenges in securing reliable connections between semiconductor chips and capacitors due to minute wiring structures, leading to high impedance and connection issues.
Innovation Solution
A method involving the formation of a wiring board with specific electrode and dielectric layers, via holes, and wiring portions to ensure secure electrical connections between the semiconductor chip and the decoupling capacitor, utilizing a laser beam to create openings and via holes, and forming multilayered wiring structures to reduce impedance and enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If minute wiring members are used for connecting a decoupling capacitor to a semiconductor chip, then the inductance is reduced, but the connection reliability deteriorates because electrodes cannot be securely connected
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional embedded structure, allowing wiring to pass through the substrate thickness direction. This enables larger via holes to be formed while maintaining compact footprint, resolving the contradiction between low inductance and secure connection.
Solution Approach 2:
The patent embeds the decoupling capacitor within the substrate structure, nesting it between conductive layers. The wiring members are embedded within the substrate rather than surface-mounted, creating a nested configuration that reduces inductance while providing secure mechanical and electrical connection through the embedded via holes.
2Volume of moving object
If a decoupling capacitor is embedded in a wiring board, then the size and thickness are reduced, but the wiring structure complexity increases
Solution Approach 1:
The patent merges the decoupling capacitor with the substrate structure itself, integrating it between conductive layers rather than treating it as a separate component. This consolidation reduces overall size while the standardized embedding process manages the complexity through systematic fabrication steps.
3Object-affected harmful factors
If minute wiring members are used, then the impedance is lowered, but the manufacturing precision requirements increase
Solution Approach 1:
The patent changes the dimensional parameters of the wiring structure by forming via holes with diameters of several micrometers rather than sub-micrometer trace widths. This parameter change from ultra-fine traces to larger-diameter vias reduces impedance while relaxing manufacturing precision requirements to achievable levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach secures stable connections between the semiconductor chip and the capacitor, reduces impedance, and allows for a thinner and more reliable wiring board with improved high-frequency noise reduction and connection reliability.
Implementation Method 1
using a laser beam having a processing diameter to form first and second via holes extending through the insulating layer formed inside the first and second openings, respectively
Data Source
AI summary
A method for manufacturing a wiring board, comprising the steps of: forming a first electrode layer having first and second opening portions, forming a dielectric layer formed on the first electrode layer and having third and fourth opening portions, forming a second electrode layer formed on the dielectric layer and having fifth and sixth opening portions, wherein the first electrode layer, the dielectric layer, and the second electrode layer form a capacitor; forming an insulating layer inside a first opening defined by the first, third, and fifth opening portions, and a second opening defined by the second, fourth, and sixth opening portions; using a laser beam having a processing diameter to form first and second via holes extending through the insulating layer formed inside the first and second openings, respectively; and forming first and second via wiring portions in the first and second via holes, respectively.