Embedded Semiconductor Die Adhesion and Resin Curing
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Solution Overview
Problem
In the manufacturing of printed circuit boards (PCBs) with embedded semiconductor devices, the semiconductor dies often twist, move, or slide out of position due to the adhesive layer being applied directly to the PCB, leading to improper electrical communication.
Innovation Solution
The semiconductor dies are manufactured with an adhesive layer on the side opposite the conductive pads, allowing them to be securely attached to the PCB without direct adhesive application, and then embedded between layers of the PCB with resin filling and a single press cycle for curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive layer is applied directly to PCB, then ease of manufacture is improved, but manufacturing precision deteriorates due to die movement and twisting
Solution Approach 1:
The adhesive layer is pre-applied to the die during semiconductor manufacturing rather than being applied to the PCB during assembly. This preliminary action ensures the adhesive is already in optimal position and condition before the die is placed on the PCB, preventing movement and twisting during the bonding process while maintaining ease of manufacture.
2Reliability
If multiple press cycles are used for curing resin, then reliability is improved, but productivity deteriorates due to increased assembly time
Solution Approach 1:
Multiple press cycles for curing resin are merged into a single press cycle by optimizing the resin formulation and pressing parameters. This consolidation maintains the reliability achieved through multiple cycles while significantly improving productivity by reducing the total assembly time and process complexity.
3Device complexity
If adhesive layer is applied to PCB, then device complexity is reduced, but stability deteriorates due to die movement and sliding
Solution Approach 1:
The adhesive layer is prepared in advance on the die surface with optimal properties for stability. This preliminary preparation ensures the adhesive has the right viscosity, tack, and bonding characteristics before the die is mounted, preventing movement and sliding while keeping the overall device complexity low.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces movement, twisting, and sliding of the dies, ensures accurate electrical contact, and shortens the PCB assembly time by using a single press cycle, while protecting the dies from liquids.
Implementation Method 1
removing a release film from an adhesive layer of the die assembly... disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB
Implementation Method 2
filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin
Data Source
AI summary
Methods and devices for embedding semiconductors in printed circuit boards (PCBs) are provided. In one example, a method of manufacturing a PCB having a die assembly embedded therein includes removing a release film from an adhesive layer of the die assembly. The method also includes disposing the die assembly on a first layer of the PCB such that the adhesive layer contacts the first layer of the PCB. The method includes disposing a second layer of the PCB over the first layer such that the die assembly is within an intermediate portion between the first layer and the second layer. The method also includes filling the intermediate portion with resin and subjecting the PCB to a press cycle to cure the resin.