Embedded Die Thermal Dissipation via Conductive Inlay
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Solution Overview
Problem
Semiconductor devices with embedded dice in organic substrates face poor thermal dissipation issues, particularly when input/output connections are through a connector, which can be critical in high-power applications.
Innovation Solution
A thermally conductive disk or button made of copper is embedded into the PCB as a dissipative inlay, directly connected to the die backside using conductive glue, facilitating heat transfer and improving thermal dissipation by creating a thermally conductive path.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If embedded dice are arranged inside an organic substrate to decrease package size, then the overall package size is reduced, but thermal dissipation performance deteriorates
Solution Approach 1:
A thermally conductive inlay (mediator) is introduced between the embedded die and the PCB to facilitate heat transfer. The inlay acts as an intermediary thermal pathway, consisting of a first portion in contact with the die backside and a second portion extending to the PCB surface, enabling efficient heat extraction while maintaining the compact embedded structure.
Solution Approach 2:
The solution employs composite material structure combining the organic PCB substrate with a thermally conductive inlay material. The inlay is formed with a material having superior thermal conductivity compared to the organic substrate, creating a hybrid structure that maintains electrical insulation while providing enhanced thermal dissipation pathways.
2Temperature
If a thermally conductive inlay is added to improve thermal dissipation, then thermal dissipation performance is improved, but device complexity increases
Solution Approach 1:
The thermally conductive inlay is merged with the PCB structure during the PCB manufacturing process itself. The inlay is formed as an integral part of the PCB layered structure, combining the thermal management function with the existing PCB fabrication steps, thereby reducing overall device complexity despite adding thermal dissipation capability.
Solution Approach 2:
The thermally conductive inlay serves multiple functions: it provides thermal conduction from the die to the PCB, acts as a structural element within the PCB layered architecture, and can potentially serve as an electrical connection pathway. This multi-functionality reduces the need for separate dedicated thermal management components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal dissipation performance, allowing for effective heat management in high-power applications, such as automotive modules, by providing a direct and efficient thermal path for heat extraction.
Implementation Method 1
a thermally conductive inlay (e.g., a button-like Cu inlay) onto which the die may be arranged, e.g., adhesively with a thermally conductive glue
Data Source
AI summary
A semiconductor device includes a layered package having a semiconductor die embedded therein, the semiconductor die coupled with a thermally-conductive element. The layered package includes, e.g., PCB boards with an intermediate layer having the semiconductor die arranged therein, and a pair of outer layers, with the thermally-conductive element including a thermally-conductive inlay in one of the outer layers.