Embedded Semiconductor Die Connector for ESD Protection
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Solution Overview
Problem
Miniaturized connectors face challenges in accommodating ancillary circuitry for electrostatic discharge protection due to limited space, necessitating innovative solutions to integrate protection circuitry effectively.
Innovation Solution
The integration of semiconductor dies with embedded protection circuitry, such as diodes, within a printed circuit substrate, allowing for stacked double-sided semiconductor structures that couple connector contacts to internal protection circuitry via conductive vias, enabling efficient electrostatic discharge protection in compact connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If connectors are miniaturized to save space in electronic devices, then the connector size is reduced, but the ability to accommodate ancillary protection circuitry deteriorates
Solution Approach 1:
The patent embeds the semiconductor die containing protection circuitry directly within the connector body, nesting the circuitry inside the limited connector volume. This allows the protection circuitry to be housed within the connector itself rather than requiring external space, resolving the contradiction between miniaturization and circuitry accommodation capability
Solution Approach 2:
The patent utilizes vertical stacking with the semiconductor die positioned beneath the contact array in the Z-dimension, rather than expanding the connector footprint in the X-Y plane. This dimensional transition enables protection circuitry integration without increasing connector size, addressing both miniaturization requirements and circuitry accommodation needs
2Reliability
If protection circuitry is added to miniaturized connectors, then electrostatic discharge protection is improved, but the connector complexity increases
Solution Approach 1:
The patent combines the protection circuitry and connector functions into a single integrated component. The semiconductor die is embedded within the connector body, merging what would traditionally be separate elements (connector and protection circuitry) into one unified structure, thereby improving ESD protection without proportionally increasing overall system complexity
Solution Approach 2:
The patent introduces a substrate as an intermediary element that houses the semiconductor die and provides electrical interconnection between the die and contact array. This substrate acts as a mediator that manages the complexity of integrating protection circuitry while maintaining a clean, organized connector structure
3Volume of moving object
If semiconductor die is embedded within printed circuit substrate, then space utilization is improved, but manufacturing complexity increases
Solution Approach 1:
The patent specifies that the semiconductor die should be pre-mounted on the substrate before assembling the final connector assembly. This preliminary action separates the complex die-embedding process from the connector assembly process, allowing each to be optimized independently and reducing overall manufacturing complexity despite the embedded configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents damage from electrostatic discharge and excessive voltages by embedding protection circuitry within the connector, ensuring reliable operation while minimizing space usage, thereby enhancing the performance and reliability of miniaturized connectors.
Implementation Method 1
The protection circuitry may include diodes that shunt excessive voltages to ground
Implementation Method 2
The protection circuitry may include diodes that shunt excessive voltages to ground
Implementation Method 3
Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts
Implementation Method 4
The first and second dies may be bonded to each other using die attach film or other bonding arrangements
Data Source
AI summary
An electrical connector may have connector contacts. Protection circuitry in the connector may prevent circuit damage. The protection circuitry may include diodes that shunt excessive voltages to ground. The protection circuitry may be implemented in a semiconductor die. The semiconductor die may be embedded within a substrate layer in a printed circuit. The printed circuit may form the body of the connector. Connector contacts may be formed on upper and lower surfaces of the printed circuit. Conductive structures such as vias in the printed circuit may be used to couple semiconductor die contacts on the semiconductor die to the connector contacts. The semiconductor die may be a double-sided die having first and second semiconductor dies that are bonded to each other in a back-to-back configuration.