Embedded-Die Semiconductor Packaging for Dense Low-Loss Interconnects

The patent transitions from planar interconnect layouts to three-dimensional vertically-stacked interconnect regions, allowing multiple interconnect layers to occupy the same footprint area. This dimensional change enables significantly higher interconnect density without proportionally increasing the package area, thereby improving signal transfer efficiency while controlling manufacturing cost through more efficient space utilization.

The patent implements nested interconnect structures where multiple interconnect regions are stacked vertically within each other, similar to nested dolls. Each interconnect layer is positioned above or below previous layers, allowing dense packing of interconnects in the vertical dimension. This nesting approach achieves high interconnect density while maintaining a compact package footprint and reasonable manufacturing complexity.

The patent applies local quality by creating distinct interconnect regions with different pitch values and surface area coverages optimized for specific functions. High-speed signal interconnects use smaller pitch and tighter spacing, while power delivery interconnects use larger pitch and broader spacing. This localized optimization allows high signal transfer speeds in critical paths while reducing overall capacitance and power consumption by not uniformly densifying all interconnect regions.

The patent segments the interconnect structure into multiple functional regions with different characteristics - some regions optimized for high-speed signaling with dense spacing, others for power delivery with sparse spacing. This segmentation allows the system to achieve high signal transfer speeds where needed while minimizing capacitance and power consumption in non-critical regions, resolving the contradiction between speed and energy use.

The patent implements multi-functional interposer structures that simultaneously serve as mechanical support substrates, electrical interconnect carriers, and thermal management components. The same interposer material and structure that provide electrical connectivity also function as a thermal pathway, eliminating the need for separate thermal management components. This universality enhances device reliability through better thermal management while avoiding the complexity increase that would result from adding dedicated thermal components.

The patent merges the thermal management function with the existing interposer and interconnect structure. By integrating thermal pathways into the same components that provide electrical connectivity and mechanical support, the design achieves improved heat dissipation without adding separate thermal management subsystems. This merging approach enhances reliability through better thermal control while maintaining relatively simple package architecture.