Embedded Semiconductor Die Thermal Layout for Dual-Sided SMD Use
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Solution Overview
Problem
High voltage semiconductor applications face challenges with stray inductances and heat dissipation, leading to thermal stress and reduced usability of substrate surfaces for surface-mounted devices (SMDs).
Innovation Solution
A semiconductor device design with a thermally conductive structure between the die and a first heatsink, and a thermally isolating structure between the die and a second heatsink, along with a leadframe for heat spreading, to efficiently dissipate heat and reduce thermal stress on the substrate surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heatsink is attached to one side of the substrate to dissipate heat from the die, then heat dissipation is improved, but the other side of the substrate becomes unusable for mounting SMDs due to excessive heat
Solution Approach 1:
The invention divides the heat dissipation function into two separate heatsinks positioned on opposite sides of the substrate. This segmentation allows each heatsink to handle heat from different directions, enabling both substrate surfaces to remain usable for mounting SMDs while maintaining effective heat dissipation from the embedded die
Solution Approach 2:
The invention transitions from a single-sided heat dissipation approach to a dual-sided approach by utilizing the third dimension (through the substrate thickness). By placing heatsinks on both the first and second surfaces of the substrate, the system creates thermal pathways in opposite directions, allowing SMDs to be mounted on both surfaces without excessive heat interference
2Reliability
If the die is embedded in the substrate to reduce parasitic inductances, then electrical performance is improved, but heat dissipation becomes more challenging due to the die being surrounded by substrate material
Solution Approach 1:
The thermal management system is segmented into two independent heat dissipation pathways, with one heatsink positioned on each side of the substrate. This allows heat to be conducted away from the embedded die in two opposite directions, effectively addressing the heat dissipation challenge created by embedding the die within the substrate
Solution Approach 2:
The substrate itself acts as an intermediary thermal conduction medium, with thermally conductive structures embedded within it to facilitate heat transfer from the die to heatsinks on both surfaces. This intermediary approach enables the substrate to simultaneously provide electrical connectivity and thermal management for the embedded die
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhanced heat transfer characteristics allow for reduced thermal stress, enabling the use of SMDs on both sides of the substrate, improving component density and operational efficiency.
Implementation Method 1
the substrate comprises a thermally conductive structure, arranged between the first surface of the die and the first heatsink
Implementation Method 2
a thermally isolating structure arranged between the second surface of the die and the second surface of the substrate opposite the first surface
Implementation Method 3
A heat sink is a spatially limited area or body that releases the thermal energy stored or supplied in it to an adjacent medium
Implementation Method 4
releases the thermal energy stored or supplied in it to an adjacent medium
Data Source
AI summary
A semiconductor device includes: a substrate; a die having a first and a second surface, the die being embedded in the substrate; a first heatsink arranged at a first surface of the substrate; and a second heatsink arranged at a second surface of the substrate. The substrate includes a thermally conductive structure arranged between the first surface of the die and the first heatsink, and a thermally isolating structure arranged between the second surface of the die and the second surface of the substrate opposite the first surface.