Embedded Die Package with Elastomer Stress Buffer
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Solution Overview
Problem
Semiconductor packages face challenges in robustness against external stresses, such as dropping and thermal expansion, leading to potential device failure, and require reduction in thickness to fit within smaller electronic devices while maintaining functionality.
Innovation Solution
A semiconductor package design with a die embedded within a substrate and surrounded by a flexible elastomer, which acts as a stress buffer to absorb external forces and thermal expansion, reducing the likelihood of damage and allowing for a thinner package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die is coupled to surface of substrate in conventional semiconductor packages, then electrical connections are established, but package thickness increases and robustness against external stresses decreases
Solution Approach 1:
The die is embedded within a cavity in the substrate, with the elastomer material surrounding and encapsulating the die. This nesting approach allows the die to be positioned within the substrate thickness rather than adding to it, while the elastomer provides stress absorption without requiring additional package height.
Solution Approach 2:
The elastomer material is positioned between the die and external environment before any stress occurs. This pre-positioned cushioning material absorbs and distributes mechanical stresses from drops or thermal expansion, protecting the die and electrical connections from damage before failure can occur.
2Reliability
If die is embedded within substrate surrounded by elastomer, then robustness against stresses improves, but manufacturing complexity increases
Solution Approach 1:
The elastomer material serves multiple functions simultaneously: it acts as a stress-absorbing cushion, provides electrical insulation, and serves as an adhesive bonding the die to the substrate. This consolidation of multiple functions into a single material reduces the number of separate components and assembly steps required.
Solution Approach 2:
The elastomer material's viscoelastic properties allow it to change its mechanical response based on temperature and stress conditions. During manufacturing, the material can be in a softened state for easy die placement, then transitions to a more rigid protective state after curing, simplifying the overall manufacturing process while maintaining protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastomer-encased die package enhances robustness against mechanical and thermal stresses, reducing the risk of failure and enabling thinner, more compact semiconductor packages that can be integrated into smaller electronic devices.
Implementation Method 1
The elastomer or flexible dielectric surrounds the die in the opening of the substrate and the elastomer acts as a stress buffer that protects the die when the semiconductor package is dropped or exposed to external stresses and forces. The elastomer protects the die because the elastomer, which is an elastic material, can compress, flex, and expand in response to external stresses and forces applied to the semiconductor package.
Implementation Method 2
Similarly, the elastomer protects the die from failure due to thermal expansion because the elastomer is able to bend and flex when the semiconductor package and layers of the semiconductor package expand and compress due to changes in temperature.
Data Source
AI summary
The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP) or a package containing a semiconductor die, with a die embedded within a substrate that is surrounded by an elastomer. The package includes nonconductive layers on surfaces of the substrate and the elastomer as well as conductive layers and conductive vias that extend through these layers to form electrical connections in the package. The package includes surfaces of the conductive material, which may be referred to as contacts. These surfaces of the conductive material are exposed on both sides of the package and allow the package to be mounted within an electronic device and have other electronic components coupled to the package, or allow the package to be included in a stacked configuration of semiconductor dice or packages.