Embedded Die Packaging With Film Layer for Compact Memory Stacks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge of working with smaller, thinner memory dies in semiconductor devices is exacerbated by increased fragility during package assembly, and there is a need to minimize the footprint of the substrate and overall package while ensuring reliable electrical connections and protection.
Innovation Solution
A film layer is applied over the semiconductor dies and bond wires, embedding them and providing a base for mounting a controller die, which protects the dies during assembly and reduces the overall device footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If smaller, thinner memory dies are used to increase storage capacity, then storage capacity is improved, but the dies become more fragile and prone to chipping or cracking during package assembly
Solution Approach 1:
A film layer is applied over the memory dies before encapsulation to provide protective cushioning during the package assembly process. This film layer acts as a cushioning barrier that prevents chipping or cracking of the fragile thin dies while allowing the encapsulation to proceed normally.
2Ease of manufacture
If memory dies and controller die are positioned side-by-side on the substrate, then electrical connections are simplified, but the substrate footprint and overall package size increase
Solution Approach 1:
The controller die is repositioned from a side-by-side horizontal arrangement to a vertical stacking arrangement above the memory dies. This dimensional change from 2D planar layout to 3D stacked configuration reduces the substrate footprint while maintaining electrical connectivity through vertical interconnections.
3Area of stationary object
If the controller die is mounted on top of the die stack, then the substrate footprint is reduced, but the controller die needs additional protection during assembly
Solution Approach 1:
The film layer is applied not only over the memory dies but also extends to provide protective cushioning for the controller die mounted on top of the die stack. This ensures that the controller die is protected from damage during encapsulation while enabling the compact vertical stacking arrangement.
Data Source
AI summary
A semiconductor device includes one or more semiconductor dies mounted on a substrate and electrically coupled to the substrate for example using bond wires. In accordance with aspects of the present technology, a film layer may thereafter be applied over the one or more semiconductor dies and bond wires. In one example, the one or more semiconductor dies may include a stack of memory dies. In this example, a controller die or other component may be mounted on top of the film layer. In another example, the one or more semiconductor dies may include a controller die mounted directly to the substrate. In this example, a stack of one or more memory dies may be mounted on top of the film layer.