Embedded Die Heater for Sub-Zero Processor Operation
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Solution Overview
Problem
Designing integrated and embedded systems to operate in extreme sub-zero temperatures poses significant challenges due to conflicting design requirements with high temperatures, leading to increased threshold voltages, power consumption, and complexity, with existing heating solutions being costly and inefficient.
Innovation Solution
Integration of a compact resistive heating element within the semiconductor substrate, using the same diffusion layer as the semiconductor devices, to generate local heat and maintain the die temperature within the designed operating range, controlled by an embedded controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If system level heaters (e.g., cartridge heaters, aluminum nitride heaters) are added to compensate for sub-zero temperatures, then the system can operate in sub-zero temperatures, but the overall system cost and complexity increase
Solution Approach 1:
The patent merges the heating function with the semiconductor device structure by integrating a resistive heating element directly into the IC die substrate. This consolidation eliminates the need for separate system-level heaters and their associated control circuits, thereby reducing overall system complexity while maintaining the ability to operate in sub-zero temperatures.
Solution Approach 2:
The heating element is nested within the IC die structure itself, utilizing the substrate as both the device platform and the heating element carrier. This nesting approach allows the heating function to be embedded within the existing device architecture rather than added as an external component, reducing complexity and improving integration.
2Temperature
If system level heaters are added to compensate for sub-zero temperatures, then the system can operate in sub-zero temperatures, but the overall system cost increases
Solution Approach 1:
By combining the heating function with the IC die substrate using standard semiconductor manufacturing processes, the patent eliminates the need for separate heater components and their assembly. This integration reduces bill of materials costs and manufacturing complexity, making the solution more cost-effective compared to adding external heaters.
Solution Approach 2:
The IC die substrate serves its own heating needs by incorporating the resistive heating element directly into its structure. This self-service approach eliminates the need for external heating components and reduces system cost by utilizing the existing substrate material and manufacturing capabilities.
3Temperature
If current devices are upsized to compensate for increased threshold voltage at low temperatures, then the devices can operate at low temperatures, but power consumption and capacitance increase
Solution Approach 1:
The patent changes the temperature parameter of the substrate by integrating a heating element that actively controls the local temperature environment. This allows the device to operate at its designed temperature range even when ambient temperature is low, eliminating the need to upsize devices and thereby maintaining optimal power consumption and capacitance characteristics.
Solution Approach 2:
The heating element provides preliminary thermal compensation before the device operates, preventing the threshold voltage increase that would otherwise require device upsizing. By pre-heating the substrate to the appropriate operating temperature, the device can maintain its original size and electrical characteristics without increased power consumption.
4Temperature
If system level heaters are added to compensate for sub-zero temperatures, then the system can operate in sub-zero temperatures, but the time to create optimal ambient temperature increases
Solution Approach 1:
The integrated heating element provides localized heating directly at the IC die substrate where it is needed, rather than attempting to heat the entire system or ambient environment. This localized approach significantly reduces the thermal mass that needs to be heated, thereby reducing the time required to reach optimal operating temperature.
Solution Approach 2:
By merging the heating function with the IC die substrate, the patent creates a direct thermal coupling between the heat source and the device. This eliminates thermal interface issues and reduces thermal resistance, allowing for faster heat transfer and quicker attainment of optimal operating temperature compared to external heating solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient and cost-effective operation in sub-zero temperatures without increasing the IC die footprint, ensuring robust system performance and ease of integration.
Implementation Method 1
a resistive heating element integrated and embedded in the integrated circuit die... to generate local heat and maintain the die temperature within the designed operating range
Data Source
AI summary
Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.