Embedded Die Package Using Pre-Molded Carrier for Rigidity

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Solution Overview

Problem

As semiconductor devices miniaturize, existing packaging methods struggle to provide sufficient rigidity and versatility to protect fragile die while maintaining economic feasibility and compatibility with various device sizes and geometries, adhering to industry standards.

Innovation Solution

The method involves forming a carrier with cavities, applying a dielectric layer, creating vias and metal conductors, adding additional dielectric layers with solder bumps, and singulating the package to create an embedded die package that is both rigid and adaptable.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If solder bumps and thin molding are used to shrink package size, then package size is reduced, but the semiconductor die lacks sufficient rigidity and protection

Engineering Contradiction:

Improvepackage sizeVSAvoidrigidity and protection of semiconductor die

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

A pre-molded carrier with cavities is formed before die attachment, providing a rigid protective structure in advance. The carrier includes side walls that enclose the die, offering mechanical support and protection before the final packaging steps are completed.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The package structure combines multiple materials including the pre-molded carrier material, dielectric layers, metal conductors, and solder bumps to create a composite structure that provides both rigidity and electrical functionality while protecting the fragile die.

Inventive Principle:

Principle #40Composite materials

2Strength

If conventional packaging methods are used to protect fragile die, then die protection is sufficient, but package size becomes large and versatility is reduced

Engineering Contradiction:

Improveprotection of semiconductor dieVSAvoidpackage size

Core Design Contradiction:

StrengthVSVolume of moving object

Solution Approach 1:

The pre-molded carrier is prepared in advance with precisely sized cavities that accommodate the die, providing protection while maintaining a compact form factor. This preliminary structure eliminates the need for excessive packaging material.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The semiconductor die is embedded within the cavities of the pre-molded carrier, which is then surrounded by dielectric layers and metal conductors, creating a nested structure that maximizes space utilization and minimizes overall package size while maintaining protection.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Adaptability or versatility

If packaging methods are customized for different device sizes and geometries, then versatility is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improvecompatibility with different device sizes and geometriesVSAvoidpackaging process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The pre-molded carrier is designed with a standardized structure that can accommodate various die sizes and geometries through its cavity design, providing a universal packaging solution that simplifies the manufacturing process while maintaining versatility.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The carrier structure is pre-configured with cavities and structural features that can adapt to different die configurations, allowing the same basic packaging process to be used for multiple device types without requiring complex custom tooling or processes.

Inventive Principle:

Principle #10Preliminary action

4Adaptability or versatility

If industry standard footprints are maintained for compatibility, then market feasibility is improved, but package design flexibility is reduced

Engineering Contradiction:

Improvecompatibility with industry standardsVSAvoidpackage design constraints

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The pre-molded carrier incorporates standardized footprint dimensions and configurations that match industry de facto standards, ensuring compatibility with existing manufacturing and assembly processes while maintaining the flexibility to accommodate different die types within the standardized framework.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS7863096B2Embedded die package and process flow using a pre-molded carrier

Publication Date: 2011.01.04 SEMICON COMPONENTS IND LLC

AI summary

An embedded die package includes a carrier with an electrical device in the cavity of the carrier, a first dielectric layer covering the sides and top of the electrical device except for vias over selected bonding pads of the electrical device, a plurality of metal conductors, each of which is in contact with at least one of the vias, one or more additional dielectric layers lying over the metal conductors and the first dielectric layer, wherein a top layer of the one or more dielectric layers has openings with metalization underneath coupled to at least one of the metal conductors, and solder bumps protruding from each of the openings.