Embedded Die Package With Elastomer Stress Buffer for Thinness
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Solution Overview
Problem
Semiconductor packages face challenges in robustness and thickness reduction while maintaining functionality, particularly in preventing damage from external stresses and thermal expansion, and in accommodating smaller form factors for emerging electronic devices.
Innovation Solution
A semiconductor package design featuring a die embedded within a substrate with a flexible elastomer surrounding the die, acting as a stress buffer to absorb external forces and thermal expansion, and a layered nonconductive structure for electrical connections, which reduces the package thickness and enhances robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the die is coupled to the surface of the substrate using conventional packaging methods, then the electrical connections are stable, but the package thickness increases and robustness against external stresses decreases
Solution Approach 1:
The die is embedded within a cavity in the substrate, with the elastomer material surrounding and filling the space around the die. This nesting approach allows the die to be positioned within the substrate thickness rather than adding to it, achieving a thinner overall package while maintaining protection through the surrounding elastomer cushion.
Solution Approach 2:
The elastomer material acts as a flexible cushion surrounding the die, providing stress absorption and protection against external forces. This flexible encapsulation replaces rigid conventional packaging structures, enabling both thinness and robustness by conforming to the die shape and absorbing mechanical stresses without adding significant thickness.
2Length of stationary object
If the die is embedded within the substrate surrounded by elastomer, then the package thickness is reduced, but the complexity of manufacturing increases
Solution Approach 1:
The elastomer material serves multiple functions simultaneously: it acts as an adhesive bonding the die to the substrate, provides mechanical cushioning against stresses, fills the cavity space, and serves as part of the encapsulation structure. This multi-functionality reduces the need for separate components and manufacturing steps, offsetting the initial complexity of creating the cavity and embedding structure.
3Reliability
If conventional packaging materials are used to protect the die, then the die is protected from external stresses, but the package thickness increases
Solution Approach 1:
The elastomer material provides protective cushioning in a thin form factor, surrounding the die within the substrate cavity. This flexible encapsulation replaces thick rigid protective housings or molding compounds, achieving stress protection through the elastic properties of the material while maintaining a thin profile that contributes to overall package thinness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The elastomer-based design significantly reduces the likelihood of die failure due to external stresses and thermal expansion, enabling thinner, more robust semiconductor packages that can be integrated into compact electronic devices with complex functionalities.
Implementation Method 1
The elastomer protects the die because the elastomer, which is an elastic material, can compress, flex, and expand in response to external stresses and forces applied to the semiconductor package
Implementation Method 2
the elastomer protects the die from failure due to thermal expansion because the elastomer is able to bend and flex when the semiconductor package and layers of the semiconductor package expand and compress due to changes in temperature
Data Source
AI summary
The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP) or a package containing a semiconductor die, with a die embedded within a substrate that is surrounded by an elastomer. The package includes nonconductive layers on surfaces of the substrate and the elastomer as well as conductive layers and conductive vias that extend through these layers to form electrical connections in the package. The package includes surfaces of the conductive material, which may be referred to as contacts. These surfaces of the conductive material are exposed on both sides of the package and allow the package to be mounted within an electronic device and have other electronic components coupled to the package, or allow the package to be included in a stacked configuration of semiconductor dice or packages.