Multi-layer Substrate with Embedded Die and Integrated Passive Components
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Solution Overview
Problem
Conventional substrate designs with embedded dies fail to achieve sufficient miniaturization and performance enhancement due to the size and performance limitations imposed by passive components and trace lengths, which affect parasitic capacitance and inductance, leading to load fluctuations and noise.
Innovation Solution
A multi-layer substrate structure with a core layer and embedded die, featuring conductive elements and dielectric layers that form electronic components, such as capacitors or transformers, to reduce size and improve performance by minimizing trace lengths and parasitic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components and trace lengths are used in conventional substrate designs, then the design can be implemented with standard packaging technologies, but the size of the whole design increases and parasitic capacitance and inductance affect performance
Solution Approach 1:
The patent merges passive components (capacitors, inductors) directly into the substrate structure by forming conductive elements that overlap in the vertical dimension. This integration eliminates the need for separate discrete passive components and their associated trace lengths, thereby reducing overall design size while maintaining electrical functionality.
Solution Approach 2:
The patent transitions from planar trace routing to three-dimensional overlapping conductive elements. By utilizing the vertical dimension for component formation, the design achieves miniaturization without compromising performance, as the overlapping structures provide both capacitance/inductance functions and signal routing within a compact footprint.
2Reliability
If trace lengths from substrate to passive components are reduced, then parasitic capacitance and inductance decrease improving performance, but the complexity of integrating passive components increases
Solution Approach 1:
The conductive elements in the substrate serve multiple functions simultaneously: they provide signal routing paths and form passive components (capacitors through overlapping with dielectric layers, inductors through spiral or meander patterns). This multi-functionality reduces the need for separate components and simplifies the overall integration process despite the advanced manufacturing capabilities required.
3Ease of manufacture
If discrete passive components are used separately from the die, then manufacturing is simpler, but the footprint of the substrate structure increases
Solution Approach 1:
The patent embeds passive components within the substrate structure itself, nesting them between conductive layers and dielectric materials. This nested configuration allows passive components to occupy the same vertical space as the active circuitry, dramatically reducing the horizontal footprint while maintaining manufacturability through standard multi-layer PCB or semiconductor fabrication processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-layer substrate structure effectively miniaturizes designs while maintaining or improving electronic performance by directly integrating passive components, reducing parasitic capacitance and inductance, and enhancing signal integrity.
Implementation Method 1
Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component
Implementation Method 2
Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer
Data Source
AI summary
The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.