Embedded Die Temperature Sensors for PCB Thermal Control
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Solution Overview
Problem
Portable electronic devices face challenges in real-time thermal control due to the need for dedicated space on the Printed Circuit Board (PCB) for temperature sensors, which is inefficient and not optimized for miniaturization, especially with redundant circuitry and varying thermal loads from components like power amplifiers and batteries.
Innovation Solution
Embedding temperature sensors within functional dies on the PCB, coupled with a processor circuit and memory, allows for real-time temperature measurement and gradient calculation, enabling efficient thermal control without increasing PCB real estate by utilizing existing circuitry and selectively using sensors from active or idle dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a thermistor or temperature sensor is included in a sensitive area of the PCB, then real-time temperature monitoring is achieved, but excess space is used in the PCB layout
Solution Approach 1:
The patent merges the temperature sensing function with existing circuit dies by embedding temperature sensors within the dies themselves rather than placing separate sensors on the PCB. This integration combines the sensing function with the existing circuitry, eliminating the need for additional dedicated sensor space on the PCB while maintaining temperature monitoring capability.
Solution Approach 2:
The patent makes existing circuit dies multi-functional by embedding temperature sensors within them. The dies serve both their original circuit function and temperature sensing function, eliminating the need for separate dedicated temperature sensor components on the PCB and thus saving PCB real estate.
2Adaptability or versatility
If redundant circuitry is included in the PCB layout, then device capability and applicability are enhanced, but the demand for PCB real estate increases
Solution Approach 1:
The patent makes redundant circuit dies multi-functional by embedding temperature sensors within them. These dies serve both their original circuit functions and temperature sensing functions, allowing the system to utilize existing circuitry for thermal monitoring without requiring additional dedicated sensor space, thus maintaining device versatility while optimizing PCB real estate.
3Measurement precision
If temperature sensors are placed in sensitive areas, then accurate temperature values are obtained, but the number of components and device complexity increases
Solution Approach 1:
The patent merges the temperature sensing function with existing circuit dies, eliminating the need for separate temperature sensor components. By embedding sensors within the dies themselves, the system achieves accurate temperature measurement while reducing the total number of discrete components and simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides accurate thermal monitoring and control, optimizing PCB space while maintaining device performance, by using embedded sensors to simulate and calculate temperature gradients, thus reducing the need for additional space and enhancing thermal management.
Implementation Method 1
A temperature sensor embedded in the die is configured to collect temperature measurements
Implementation Method 2
a processor circuit coupled to the temperature sensor reads a measurement from the temperature sensor and calculates a temperature gradient
Data Source
AI summary
A portable electronic device including a temperature sensor embedded in a die is provided. To process temperature measurements the portable electronic device includes a processor circuit coupled to the temperature sensor, the processor circuit configured to read a measurement from the temperature sensor when an integrated circuit in the die is inactive. Furthermore, a memory circuit coupled to the processor circuit and the temperature sensor stores a temperature gradient provided by the temperature sensor. A Printed Circuit Board for use in a portable electronic device as above is also provided. A method for performing thermal control in a portable electronic device as above is also provided.