Embedded Component Dielectric Layer for Thin Carrier Interconnects
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Solution Overview
Problem
Efficiently embedding components in component carriers while ensuring mechanical robustness, electrical reliability, and effective heat removal, particularly in the context of miniaturized and densely packed electronic components, is a challenge.
Innovation Solution
A component carrier design incorporating a dielectric layer on the component's surface that does not extend beyond the main surface laterally, with conductive contacts formed through openings in the dielectric layer, allowing for direct electrical connection of pads without additional lamination steps, and using materials like epoxy resin or photo-imagable dielectric for precise manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dielectric layer is applied to cover the pads of a component before embedding, then the electrical connection precision is improved, but the number of additional lamination steps increases
Solution Approach 1:
The dielectric layer is applied to cover the pads of the component before the component is embedded in the component carrier. This preliminary action protects the pads and defines the electrical connection points in advance, eliminating the need for subsequent lamination steps to create the dielectric structure, thus reducing manufacturing complexity while maintaining precision
Solution Approach 2:
The dielectric layer application is merged with the component preparation process before embedding. By combining the dielectric layer formation with the component assembly preparation, the patent eliminates separate lamination steps that would otherwise be required, reducing both the number of process steps and overall manufacturing complexity
2Length of stationary object
If the dielectric layer does not extend beyond the main surface laterally, then the component carrier thickness is reduced, but the electrical insulation reliability may be compromised
Solution Approach 1:
The dielectric layer is applied with specific local coverage - it covers the pads and extends to the main surface boundaries but does not protrude laterally beyond the component edges. This localized precision ensures adequate electrical insulation where needed (at the pads and connections) while maintaining a thin overall profile, achieving both thickness reduction and insulation reliability through spatially optimized dielectric placement
3Adaptability or versatility
If multiple components are embedded with smaller spacing, then the product functionality is improved, but the heat removal efficiency deteriorates
Solution Approach 1:
The thin dielectric layer structure enables closer component spacing while maintaining electrical insulation. The optimized dielectric configuration provides sufficient insulation between densely packed components without requiring thick spacing, allowing higher component density for improved functionality while the component carrier's thermal management structures can effectively remove heat from the compact arrangement
Data Source
AI summary
A component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and a component having one or more pads and at least one dielectric layer on at least one main surface of the component. The at least one dielectric layer does not extend beyond the main surface in a lateral direction. The dielectric layer at least partially covers one or more pads of the component. In addition, at least one electrically conductive contact extends through at least one opening in the dielectric layer up to at least one of the pads.