Embedded DIMM Flip-Chip Layout Without Wire Bonding
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Solution Overview
Problem
Conventional dual in-line memory modules (DIMMs) face issues with poor electrical performance, increased manufacturing costs, and reduced service life due to the use of wire bonding for electrical connections, which also exposes components to damage and oxidation.
Innovation Solution
An embedded DIMM design where memory chips are directly connected to the printed circuit board (PCB) using flip-chip technology, eliminating the need for wire bonding and incorporating a sealing film layer to protect the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then electrical connections can be established, but electrical performance deteriorates and manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the manufacturing flow. Memory chips are directly connected to the PCB through flip-chip technology, removing the intermediate wire bonding step that caused electrical performance degradation and structural complexity
Solution Approach 2:
The patent replaces the mechanical wire bonding process with a direct flip-chip mounting process. Instead of using metal wires to create electrical connections, the memory chips are directly flipped and bonded to the PCB using solder balls or other direct bonding methods, eliminating the mechanical wire structure
2Reliability
If wire bonding and chip packaging processes are used, then electrical connections are established, but manufacturing cost increases
Solution Approach 1:
The patent merges the chip packaging and PCB mounting processes into a single flip-chip mounting step. By eliminating the separate wire bonding process and integrating the electrical connection function directly into the chip mounting process, the overall manufacturing complexity and cost are reduced
Solution Approach 2:
The patent extracts and removes the wire bonding process from the manufacturing sequence, leaving only the essential flip-chip mounting process. This reduction in process steps directly lowers manufacturing costs while maintaining electrical connection reliability
3Device complexity
If memory chips are directly connected to PCB by flip chip, then wire bonding is eliminated, but new manufacturing process is required
Solution Approach 1:
The patent replaces the traditional wire bonding mechanical system with a flip-chip mounting system. This substitution eliminates the need for wire bonding equipment and processes, replacing them with automated flip-chip mounting equipment that achieves both structural simplification and manufacturing efficiency
4Ease of manufacture
If printed circuit board and chip package are exposed, then assembly is simple, but components are easily damaged and oxidized
Solution Approach 1:
The patent applies a sealing film layer over the memory chips and PCB assembly. This thin film encapsulation protects the exposed metal components from oxidation and environmental damage while maintaining the compact structure and not significantly complicating the manufacturing process
Data Source
AI summary
An embedded dual in-line memory module (DIMM) is provided. The memory module includes a printed circuit board (PCB), a first memory chip set, and a second memory chip set. A plurality of memory chips of the first memory chip set is arranged and electrically connected to a first circuit layer of the PCB by flip chip. A plurality of memory chips of the second memory chip set is arranged and electrically connected to a second circuit layer of the PCB by flip chip. The respective chips are directly disposed on the PCB by flip chip. Thereby the memory module has a condition that there is no metal wire for electrical connection generated by wire bonding. This helps cost reduction at manufacturing end and improves electrical performance.