Embedded Diode Heat Removal via Continuous Layer
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Solution Overview
Problem
The challenge is to efficiently and reliably operate a component carrier with embedded diode components, particularly in terms of heat removal and mechanical robustness, as existing technologies often struggle with moderate heat removal capabilities and maintaining electrical reliability under harsh conditions.
Innovation Solution
A component carrier is designed with a continuous heat removal layer covering a substantial main surface, utilizing highly thermally conductive materials like copper, and an electrically insulating layer to decouple electrical and thermal functions, ensuring efficient heat dissipation and mechanical protection of diode components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a continuous heat removal layer covering a substantial main surface is used, then heat removal efficiency is improved, but device complexity increases
Solution Approach 1:
The heat removal layer is designed to serve dual functions: it acts as a thermal management solution for efficient heat dissipation from embedded diodes, and simultaneously functions as an electrical connection element through its integration with conductive layers. This multi-functionality reduces the need for separate dedicated components, thereby managing device complexity while maintaining high heat removal efficiency.
Solution Approach 2:
The patent combines the heat removal function with the electrical connection function by integrating the heat removal layer with the electrically conductive layer structure. The continuous heat removal layer is merged with conductive paths that provide both thermal conduction and electrical connectivity, reducing the number of separate layers and simplifying the overall device structure.
2Temperature
If highly thermally conductive materials like copper are used in the heat removal layer, then heat removal efficiency is improved, but electrical interference increases
Solution Approach 1:
The patent introduces an electrically insulating layer positioned between the embedded diode components and the continuous heat removal layer. This intermediary layer serves as a thermal conductor while blocking electrical interference, allowing heat to pass through to the copper heat removal layer while preventing direct electrical contact that would cause interference or short circuits.
Solution Approach 2:
The heat removal layer is designed with spatially varying properties: regions closer to the embedded diodes have enhanced thermal conductivity for efficient heat extraction, while the overall continuous layer provides electrical isolation benefits. The insulating layer is strategically placed only where electrical isolation is needed, allowing copper to be used in regions where thermal conduction is prioritized.
3Device complexity
If embedded diode components are integrated into the component carrier, then device complexity is reduced, but heat removal capability deteriorates
Solution Approach 1:
The patent transitions from traditional planar heat removal to a three-dimensional thermal management architecture. The continuous heat removal layer extends across the entire main surface of the component carrier, creating multiple thermal pathways in the vertical dimension. Embedded diodes are integrated within the carrier structure, allowing heat to be conducted through multiple layers and paths, effectively increasing heat removal capability while maintaining compact integration.
Solution Approach 2:
The heat removal function is segmented into multiple conductive paths within the continuous heat removal layer. The layer is divided into regions that specifically target heat extraction from individual embedded diodes, with conductive pathways distributed throughout the carrier structure. This segmentation allows efficient heat removal from each embedded component while maintaining the overall integrated design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration provides effective heat removal and mechanical protection, enhancing the thermal and electrical performance of the component carrier, allowing for efficient operation and low ohmic and inductance losses, while maintaining a compact and reliable design.
Implementation Method 1
utilizing highly thermally conductive materials like copper
Data Source
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AI summary
A component carrier (100) which comprises an interconnected stack (102) comprising at least one electrically insulating layer structure (104) and/or at least one electrically conductive layer structure (106), a component (108) embedded in the stack (102) and comprising a diode (110), and at least one heat removal layer (112, 118) configured for removing heat from the diode (110) and substantially fully covering a whole main surface of the component carrier (100).