Embedded Dummy Disk for CMP Pad Preparation

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Solution Overview

Problem

Chemical-mechanical polishing (CMP) processes in semiconductor manufacturing face challenges in extending the life of polishing pads and reducing costs, as existing methods require frequent loading of dummy disks that consume pad thickness and increase operational costs.

Innovation Solution

Incorporating embedded dummy disks within the CMP tool, made of unpatterned films matching the materials of production wafers, which are polished internally to prepare the polishing pad and slurry for wafer processing, eliminating the need for external loading and reducing pad consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external dummy disks are loaded into the CMP tool, then the polishing pad is prepared for wafer processing, but the polishing pad life is reduced due to consumption of pad thickness

Engineering Contradiction:

Improvepolishing pad efficiencyVSAvoidpolishing pad life

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The dummy disk is integrated within the wafer carrier structure, nesting the dummy disk preparation function inside the existing wafer handling system. This eliminates the need for separate external dummy disk loading while maintaining the pad preparation function.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent combines the dummy disk preparation function with the wafer carrier and integrates it into the existing CMP tool chamber. This merging eliminates the separate external dummy disk loading process and reduces pad consumption by optimizing the preparation workflow.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If external dummy disks are loaded into the CMP tool, then the polishing pad is prepared, but operational costs increase due to frequent loading and pad consumption

Engineering Contradiction:

Improvepolishing pad efficiencyVSAvoidoperational cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The dummy disk preparation function is merged with the wafer carrier system and integrated into the existing CMP tool chamber. This eliminates the need for separate external dummy disk loading equipment and operations, reducing operational costs while maintaining pad preparation efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The wafer carrier is given multi-functionality by incorporating the dummy disk preparation capability. The same carrier structure serves both for holding wafers during processing and for preparing the polishing pad through integrated dummy disk operations, reducing the need for dedicated dummy disk handling equipment.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Reliability

If dummy disks are used to prepare the polishing pad, then the CMP environment is prepared, but time is lost due to frequent loading and unloading operations

Engineering Contradiction:

ImproveCMP environment preparationVSAvoidoperational time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The dummy disk preparation function is nested within the wafer carrier and integrated into the CMP tool chamber. This allows pad preparation to occur within the existing operational workflow without requiring separate loading/unloading cycles, thereby reducing time loss.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The integrated dummy disk system enables preliminary preparation of the polishing pad to occur efficiently within the tool chamber before wafer processing begins. This preliminary action is streamlined through the integrated design, reducing the time required for environment preparation.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach extends the life of the polishing pad, reduces costs by avoiding external dummy disk loading, and maintains polishing pad efficiency by preparing the CMP environment within the tool, thereby enhancing the overall CMP process.

Implementation Method 1

Chemical-mechanical polishing (CMP) is a process used to smooth and planarize surfaces of wafers using a combination of chemical and mechanical forces

Methodology Applied

Scientific EffectChemical-mechanical polishing:

Implementation Method 2

A liquid dispersion referred to as a slurry that contains chemicals and microabrasive grains is applied to the polishing pad during the CMP process

Methodology Applied

Scientific EffectAbrasion: Abrasion

Data Source

PatentUS10312128B2Chemical-mechanical polish (CMP) devices, tools, and methods

Publication Date: 2019.06.04 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Chemical-mechanical polishing (CMP) devices, tools, and methods are disclosed. In some embodiments, a device for a CMP tool includes a carrier and an embedded dummy disk coupled to the carrier. The embedded dummy disk comprises a substrate and a film disposed over the substrate. The carrier is coupleable to an arm of a handler of the CMP tool. The carrier and the embedded dummy disk are adapted to be embedded within a housing of the CMP tool. The embedded dummy disk is adapted to be polished by the CMP tool in preparation for a polishing process for a wafer.