Embedded Electrical Nodes With Barrier-Controlled Potting
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Solution Overview
Problem
Existing methods for manufacturing electrical nodes in multilayer structures face challenges such as reliability risks, assembly yield issues, and thermal management problems due to complex geometries and the need for external control electronics, which increase costs and reduce integration efficiency.
Innovation Solution
A method involving the creation of electronic circuits on a substrate with a filler material layer, where the circuits are embedded in a potting or casting material, and a barrier element is used to confine the material, allowing for easier control of voiding and separation of electrical nodes, reducing the need for expensive equipment and improving integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If complex electrical circuits are produced on a substrate and overmolded by plastic material, then electronic functionalities are integrated, but reliability risks and assembly yield issues arise due to challenges in integrating dense components and components with complex geometries
Solution Approach 1:
The patent divides the substrate into multiple segments or zones, each containing specific electronic components. This segmentation allows for simplified individual zones that are easier to manufacture and assemble reliably, while the collection of zones provides the overall complex functionality. The substrate is effectively partitioned into manageable units rather than attempting to integrate all components in a single complex area.
Solution Approach 2:
The patent transitions from planar 2D circuit layouts to three-dimensional vertical stacking of electronic components and substrates. By utilizing the vertical dimension, the design achieves complex functionality without increasing the planar footprint, and allows for simpler individual component geometries that are easier to manufacture and assemble with higher reliability.
2Adaptability or versatility
If external control electronics are used to achieve desired functionalities, then functional requirements are met, but degree of integration is reduced and structures become less attractive
Solution Approach 1:
The patent merges the control electronics directly into the substrate structure itself, eliminating the need for separate external control electronics. The substrate integrates both the structural support function and the electronic control function, combining what would traditionally be separate components into a unified structure, thereby increasing the degree of integration while maintaining all required functionalities.
Solution Approach 2:
The substrate is designed to serve multiple functions simultaneously: it provides mechanical support, hosts electronic components, and incorporates control electronics directly within its structure. This multi-functionality eliminates the need for separate dedicated control electronics, achieving high integration while meeting all functional requirements through a universal structural platform.
3Adaptability or versatility
If dense components and components of complex geometry are integrated onto a substrate, then functionalities are achieved, but assembly yields in different production phases can be very low
Solution Approach 1:
The patent segments the electronic assembly into multiple simpler zones or modules on the substrate, each with less complex component arrangements. This segmentation enables higher assembly yields for each individual zone while the complete assembly provides the full functionality. The complex geometry challenge is distributed across multiple simpler segments rather than concentrated in a single complex area.
Solution Approach 2:
The patent incorporates control electronics and critical components directly into the substrate structure during the substrate manufacturing process itself, before the final assembly phase. This preliminary integration of control functions into the substrate reduces the complexity of subsequent assembly operations, thereby improving assembly yields in later production phases while maintaining all required functionalities.
4Object-affected harmful factors
If subassemblies are mounted on a PCB and covered with a plastic layer, then protection is provided, but mismatch in thermal expansion and stresses can tear the subassemblies off their electrical contacts
Solution Approach 1:
The patent modifies the material parameters of the substrate, specifically its thermal expansion coefficient, to match or closely align with that of the mounted subassemblies and electronic components. By changing this critical parameter, the substrate accommodates thermal cycling without generating differential expansion stresses that would otherwise tear subassemblies from their electrical contacts, while still providing environmental protection through the integrated structure.
5Object-affected harmful factors
If complex geometries are filled with material, then complete encapsulation is achieved, but voids form and control costs increase
Solution Approach 1:
The patent divides the encapsulation process into multiple smaller zones corresponding to the segmented substrate areas. Each zone is filled with encapsulant material separately, allowing for complete encapsulation of each individual zone without the void formation problems associated with filling large complex geometries in a single operation. This segmented approach maintains encapsulation completeness while reducing voiding control costs.
Solution Approach 2:
The patent performs preliminary preparation of the substrate and component arrangement to optimize the encapsulation process. Critical components and control electronics are positioned and integrated into the substrate structure before encapsulation, and the substrate geometry is designed to facilitate complete material filling without voids. This preliminary structuring enables complete encapsulation with reduced voiding control costs by eliminating the need for complex void management during the filling process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient manufacturing of electrical nodes with improved reliability and reduced costs by simplifying the geometry and reducing voiding issues, allowing for high-yield production of integrated electrical nodes with enhanced thermal management.
Implementation Method 1
hardening, optionally including curing, the potting or casting material to form a filler material layer
Implementation Method 2
the method may comprise applying low pressure, such as substantially a vacuum, at least onto a side of the first substrate comprising the filler material layer for removing bubbles from the filler material layer
Data Source
AI summary
The method for manufacturing a number of electrical nodes, wherein the method includes providing a number of electronic circuits onto a first substrate, such as on a printed circuit board or other electronics substrate, optionally, a low-temperature co-fired ceramic substrate, wherein each one of the electronic circuits includes a circuit pattern and at least one electronics component in connection with the circuit pattern, wherein the electronic circuits are spaced from each other on the first substrate, thereby defining a blank area surrounding each one of the number of electronic circuits, respectively, and providing potting or casting material to embed each one of the number of electronic circuits in the potting or casting material, and, subsequently, hardening, optionally including curing, the potting or casting material to form a filler material layer of the number of electrical nodes.