Embedded Electronic Component Electrode With Low-Reflection Layer

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Solution Overview

Problem

The precision of via hole formation in circuit boards is compromised due to light energy reflection during laser processing, leading to deteriorated connectivity between electronic components and conductive vias, affecting the performance of embedded electronic components.

Innovation Solution

The implementation of an electronic component with a low-reflection layer, specifically a Ni—Zn-based material containing needle-shaped particles and an oxide film, which reduces surface brightness to 45% or less, thereby minimizing light energy reflection and improving processing precision during via hole formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional external electrode with high reflectivity is used, then the manufacturing process is simple, but light energy reflection during laser processing deteriorates via hole formation precision and connectivity

Engineering Contradiction:
Improvevia hole formation precisionVSAvoidexternal electrode structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The external electrode is segmented into multiple layers: a base layer (first external electrode layer) and a low-reflection layer (second external electrode layer). This segmentation allows the base layer to provide structural foundation while the low-reflection layer specifically addresses light reflection issues, thereby improving via hole formation precision without compromising electrode functionality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The low-reflection layer is constructed using composite materials including Ni-Zn-based material with needle-shaped particles and oxide film. This composite structure reduces light reflectivity to 45% or less while maintaining electrical conductivity and adhesion properties, resolving the contradiction between manufacturing precision and device complexity.

Inventive Principle:
Principle #40Composite materials

2Object-affected harmful factors

If a low-reflection layer with Ni-Zn-based material and needle-shaped particles is implemented, then light energy reflection is reduced to 45% or less, but the external electrode structure becomes more complex

Engineering Contradiction:
Improvelight energy reflectionVSAvoidexternal electrode structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The low-reflection layer changes key parameters including material composition (Ni-Zn-based alloy), particle morphology (needle-shaped particles), and surface properties (oxide film formation). These parameter changes reduce light reflectivity to 45% or less while the layered structure maintains electrode functionality, effectively managing the trade-off between reducing harmful reflection and controlling structural complexity.

Inventive Principle:
Principle #35Parameter changes

3Reliability

If the brightness of the external electrode surface is high, then the manufacturing and inspection process is easier, but light energy reflection during laser processing increases, deteriorating connectivity

Engineering Contradiction:
Improveconnectivity between electronic component and conductive viaVSAvoidsurface brightness
Core Design Contradiction:
ReliabilityVSIllumination intensity

Solution Approach 1:

The invention converts the harmful effect of high reflectivity into a beneficial property by deliberately designing a low-reflection layer with controlled brightness. The needle-shaped particles and oxide film create a surface that reduces light reflection to 45% or less, transforming the potential harm (light reflection interfering with laser processing) into a benefit (improved via hole formation precision and connectivity).

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the connectivity between electronic components and conductive vias by reducing light energy reflection, resulting in improved processing precision and reliability of the electronic components embedded in circuit boards.

Implementation Method 1

a low-reflection layer, specifically a Ni—Zn-based material containing needle-shaped particles and an oxide film, which reduces surface brightness to 45% or less, thereby minimizing light energy reflection

Methodology Applied
Scientific EffectLight reflection reduction: Reflection

Data Source

PatentUS20240387110A1Electronic component and substrate with electronic component embedded therein
Publication Date: 2024.11.21 SAMSUNG ELECTRO MECHANICS CO LTD
  • US20240387110A1 patent drawing
  • US20240387110A1 patent drawing
  • US20240387110A1 patent drawing

AI summary

An electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body, connected to the internal electrode, and including a low-reflection layer. Brightness of a surface of the low-reflection layer is lower than brightness of a surface of the body.