Embedded Electrode Solid Capacitor Reducing ESR
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Solution Overview
Problem
Existing solid electrolytic capacitors face increased Equivalent Series Resistance (ESR) due to the use of lead frames, which also limits their high-frequency capacitance and manufacturing efficiency.
Innovation Solution
A conductive structure with an embedded electrode is developed, comprising a substrate unit, conductive units with varying porosity rates, insulative units, and end electrode units, where the conductive body is embedded into the substrate to reduce electrode path resistance and allow for separate manufacturing of positive and negative electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frames are used in solid electrolytic capacitors, then structural support and electrode connection are achieved, but Equivalent Series Resistance (ESR) increases
Solution Approach 1:
The patent removes the lead frame component entirely from the capacitor structure. Instead of using traditional lead frames for electrode connection and structural support, the invention embeds the electrode directly into the solid electrolyte, eliminating the source of increased ESR while maintaining necessary electrical connections through alternative means.
Solution Approach 2:
The patent combines the electrode and solid electrolyte into a single integrated structure where the electrode is embedded within the electrolyte matrix. This merging eliminates the separate lead frame component and reduces the number of interfaces between components, thereby reducing ESR and simplifying the overall device structure.
2Productivity
If lead frames are used for electrode connection, then electrical connection is established, but manufacturing efficiency decreases
Solution Approach 1:
By merging the electrode fabrication with the solid electrolyte formation process, the patent eliminates separate assembly steps for installing lead frames. The electrode is created in-situ within the electrolyte during a single manufacturing process, significantly improving manufacturing efficiency and reducing assembly complexity.
Solution Approach 2:
The patent performs preliminary electrode formation within the solid electrolyte structure before final capacitor assembly. This preliminary action integrates multiple functions into earlier manufacturing stages, reducing the number of subsequent assembly operations required and improving overall manufacturing efficiency.
3Reliability
If lead frames are used, then structural support is provided, but high-frequency capacitance performance is limited
Solution Approach 1:
The patent extracts the lead frame from the structure, removing the long electrode paths and multiple interfaces that limit high-frequency performance. The direct embedding of electrodes in the solid electrolyte creates shorter current paths and reduces parasitic inductance, improving high-frequency capacitance response.
Solution Approach 2:
The patent transitions from a planar lead frame structure to a three-dimensional embedded electrode configuration. This dimensional change allows for optimized current distribution and reduced path lengths through the electrolyte, enhancing high-frequency performance by eliminating the geometric limitations of flat lead frame connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces ESR, increases manufacturing productivity, and enables the production of solid capacitors with either a single or multiple positive electrodes, improving high-frequency performance and manufacturing efficiency.
Implementation Method 1
the conductive body has at least one lateral conductive area exposed from the at least one lateral opening and a plurality of top conductive areas respectively exposed from the top openings
Implementation Method 2
the at least one second conductive layer has a porosity rate larger than that of each first conductive layer
Implementation Method 3
the electrolyte layer includes many cavities, into which conductive particles constituting the cathode member formed on the electrolyte layer penetrate
Data Source
AI summary
A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.