3D Embedded Electrodes for Bulk Sensor Signal Detection
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Solution Overview
Problem
Conventional surface electrode structures in sensing applications are inadequate for bulk or thick film materials, leading to limited electric field distributions and poor charge transport, which restricts signal detection and sensitivity, especially in materials with dispersive transport mechanisms.
Innovation Solution
A three-dimensional embedded electrode structure is introduced, allowing independent control of sensitive material thickness, area, electric field intensity, and field direction, enhancing signal detection and sensitivity in bulk resistive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If surface electrode structures are used in bulk sensing materials, then the device complexity is reduced, but the electric field distribution is limited and charge transport is poor
Solution Approach 1:
The patent transitions from two-dimensional surface electrodes to three-dimensional embedded electrodes that extend into the bulk sensing material. This dimensional change allows electric fields to be distributed throughout the volume of the material rather than being confined to the surface, thereby improving charge transport and signal detection reliability while maintaining reasonable device complexity
Solution Approach 2:
The embedded electrode structure is nested within the bulk sensing material, with electrodes positioned inside channels or cavities formed within the material matrix. This nesting approach enables the electrodes to be surrounded by sensing material on multiple sides, creating effective electric fields throughout the bulk volume without requiring overly complex external wiring or structure
2Ease of manufacture
If surface electrode structures are used, then manufacturing is simpler, but sensitivity and signal-to-noise ratio are insufficient
Solution Approach 1:
The sensing material is formed with channels or porous structures that accommodate the embedded electrodes. These pre-formed channels guide the electrode placement and simplification the manufacturing process, while the surrounding sensing material ensures effective electric field distribution and high measurement precision throughout the bulk volume
3Device complexity
If planar electrodes are used, then the structure is simpler, but electric field intensity is insufficient in the sensitive direction
Solution Approach 1:
By embedding electrodes in three dimensions rather than placing them only on the surface, the patent creates electric field lines that extend through the bulk material in the sensitive detection direction. This dimensional transition enables sufficient electric field intensity to be achieved without requiring overly complex electrode geometries or high voltages
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The embedded electrode structure improves signal-to-noise ratio and sensitivity by generating high electric fields throughout the sensing material, overcoming limitations of conventional planar electrodes and enabling effective electronic sensing in materials with dispersive charge transport.
Implementation Method 1
energizing three dimensional electrodes that are at least partially embedded in an electrically resistive material to form an electric field across channels formed by facing portions of the three-dimensional electrodes
Implementation Method 2
detecting current upon radiation encountering the sensing material and the electric field migrating ionized charges from the electrically resistive material towards the electrodes
Implementation Method 3
upon radiation encountering the sensing material
Implementation Method 4
the electric field migrating ionized charges from the electrically resistive material
Data Source
AI summary
A micro-structured device that can improve sensitivity and signal-to-noise for electronic sensor materials is embedded in electrically resistive materials. The technology includes a three-dimensional embedded electrode structure and fabrication methods for making the device for electronic sensing in bulk resistive materials. Embedded electrode structures address issues in conventional sensors by allowing independent control of sensitive material thickness, area, electric field intensity, and field direction.