Embedded Electronics in Composite Lay-up via Resin Flow
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Solution Overview
Problem
Aircraft manufacturing requires integrating electronic components into composite structures while maintaining mechanical robustness and reducing weight and cost, as conventional methods often result in bulky and heavy wiring due to mechanical design considerations.
Innovation Solution
A method of forming composite materials with embedded electronic components by positioning conductive ink and fibers on a lay-up surface, allowing resin to flow and cure, thereby integrating electronic components like wiring harnesses and sensors within the composite structure, providing mechanical support and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wiring methods are used to provide mechanical robustness, then reliability is improved, but weight and cost increase
Solution Approach 1:
The patent merges the wiring harness with the composite laminate structure by embedding conductive traces directly into the resin matrix during the lay-up and curing process. This integration eliminates separate wiring components, reducing overall weight while maintaining mechanical robustness through the composite structure's inherent strength.
Solution Approach 2:
The invention uses composite materials by combining conductive traces with resin and fiber layers to create an integrated wiring-structure. The conductive elements are embedded within the composite laminate, allowing the structure to provide both mechanical support and electrical connectivity simultaneously, thereby reducing weight compared to traditional separate wiring systems.
2Ease of operation
If separate assembly steps are used for installing electronic components, then ease of operation is improved, but productivity decreases
Solution Approach 1:
The patent applies preliminary action by positioning conductive traces and electronic components during the lay-up process before the resin is applied and cured. This allows the wiring and structural elements to be pre-integrated into the laminate, eliminating the need for separate post-assembly steps and significantly improving productivity while maintaining ease of operation through careful planning of the lay-up sequence.
Solution Approach 2:
The invention combines multiple assembly operations into a single integrated lay-up and curing process. By embedding conductive traces and installing electronic components during the composite laminate formation, the patent eliminates separate wiring installation steps, thereby reducing the total number of assembly operations and improving overall productivity.
3Reliability
If protective measures are added for electronic components, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the protective function into the composite laminate structure itself. The resin matrix and fiber layers provide inherent protection for embedded conductive traces and electronic components, eliminating the need for separate protective structures. This integration maintains reliability while minimizing device complexity by using the structural laminate as both the load-bearing element and the protective barrier.
Solution Approach 2:
The invention uses composite materials to provide protection, where the resin and fiber composite structure serves as both the structural element and the protective barrier for electronic components. The composite laminate's inherent properties provide mechanical protection and environmental shielding, eliminating the need for additional protective layers or structures and thereby reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of assembly steps, minimizes the weight and cost of electronic components, enhances mechanical robustness, and protects electronic components from damage, while maintaining the structural integrity of the composite materials.
Implementation Method 1
causing a flow of the resin between the lay-up surface and the fibers
Implementation Method 2
curing the resin to form a cured resin
Data Source
AI summary
A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.