Embedded Electronics Module with Two-Sided Contact Terminals
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Solution Overview
Problem
Existing electronics module designs are inefficient in minimizing size due to the need for separate vias to connect components to both surfaces of a circuit board, leading to increased thickness and complexity.
Innovation Solution
Embedding components with two-sided contact terminals, allowing direct electrical connection to both surfaces of the module through insulating and conductive layers, with precise alignment and adhesive or metallurgical joining methods to create efficient electrical contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate vias are used to connect components to both surfaces of the circuit board, then electrical connection is achieved, but the module thickness and complexity increase
Solution Approach 1:
The patent merges the component embedding process with the conductor layer formation process. Components are embedded in the insulating material layer before the conductor layers are formed, allowing conductor structures to be created that directly connect to both surfaces of the module without requiring separate via holes. This integration eliminates the need for additional via structures and reduces overall module complexity.
Solution Approach 2:
The patent utilizes two-sided contact terminals that extend from both surfaces of the component body. By forming conductor layers on both the first and second surfaces of the insulating material layer, electrical connections are established in multiple dimensions simultaneously, eliminating the need for through-hole vias that would increase thickness.
2Area of stationary object
If components are embedded in the circuit board, then space utilization is improved, but manufacturing complexity increases due to additional vias
Solution Approach 1:
Components are embedded in the insulating material layer before the conductor layers are formed. This preliminary embedding allows subsequent conductor layer formation to directly create connection structures without requiring pre-drilled via holes, simplifying the manufacturing process while maintaining effective space utilization.
3Ease of manufacture
If components with single-sided contact terminals are used, then manufacturing is simpler, but space utilization and connection efficiency are reduced
Solution Approach 1:
The patent employs components with contact terminals on both the first and second surfaces, making the components multi-functional. Each component can simultaneously establish electrical connections with conductor layers on both surfaces of the module, doubling the connection efficiency and space utilization compared to single-sided terminals while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables thinner, more compact electronics modules that effectively utilize both sides of components and the module surface area, facilitating efficient electronic design and manufacturing.
Implementation Method 1
a) a component (6) is glued to the first conductor layer (4)
Data Source
AI summary
This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component (6) embedded in an insulating-material layer (1), which has a first contacting surface, in which there are first contact terminals (7), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. In addition, the component (6) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal (7′), from which the component (6) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.