Embedded Electronics Redistribution Layer for Ultrasound Signal Routing
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Solution Overview
Problem
Existing ultrasound systems face challenges in efficiently routing and processing a large number of signals from transducer arrays to processing electronics, leading to increased complexity, cost, and potential degradation of image quality due to acoustic impedance mismatches and unintended reflections introduced by interposers or air gaps.
Innovation Solution
Embedding electronics within a material with a redistribution layer that electrically couples the transducer array and processing electronics, reducing the need for interposers and minimizing acoustic impedance mismatches, while maintaining efficient signal routing and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an interposer is added between the transducer array and electronics to reduce signal routing complexity, then the number of signals is reduced from thousands to hundreds, but additional material and air gaps are introduced that cause acoustic impedance mismatches and unintended reflections
Solution Approach 1:
The patent merges the interposer material with the acoustic coupling medium by using the same material for both purposes. This eliminates the separate interposer structure and its associated air gaps, thereby reducing acoustic impedance mismatches and unintended reflections while maintaining the signal routing reduction benefit
Solution Approach 2:
The patent introduces a specific intermediary material with acoustic impedance properties that match both the transducer array and the electronics packaging. This intermediary serves as both the structural support for signal routing and the acoustic coupling medium, eliminating the need for separate acoustic coupling layers
2Ease of manufacture
If solder is used to join the electrical contacts of the interposer and transducer array, then electrical connections are established, but the heat applied may degrade the transducing properties of the transducer array
Solution Approach 1:
The patent changes the thermal parameter by using a low-temperature bonding process instead of traditional high-temperature soldering. This allows electrical connections to be established without applying excessive heat that would degrade the transducer array's piezoelectric properties
Solution Approach 2:
The patent replaces the thermal-mechanical soldering process with an alternative bonding method such as eutectic bonding or conductive adhesive bonding. This substitution eliminates the need for high-temperature melting and flow of solder, thereby protecting the transducer elements from thermal degradation
3Ease of operation
If thousands of interconnects are drilled and routed between the transducer and electronics, then electrical communication is established, but the process becomes challenging and costly
Solution Approach 1:
The patent transitions from a planar two-dimensional routing approach to a three-dimensional vertical stacking architecture. By routing signals vertically through the interposer rather than horizontally across the substrate, the number of interconnects is dramatically reduced from thousands to hundreds, simplifying both manufacturing and assembly
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces signal complexity and cost, improves acoustic performance, and enhances image quality by eliminating additional material and air gaps that can cause reflections, resulting in better ultrasound imaging.
Implementation Method 1
at least one redistribution layer electrically coupled to the embedded electronics, wherein the at least one redistribution layer electrically couples the ultrasound transducer array and the electronics
Data Source
AI summary
An ultrasound system (100) includes an ultrasound transducer array and a component (108) with electronics (110) embedded in a material (112) with at least one redistribution layer (114) electrically coupled to the embedded electronics, wherein the at least one redistribution layer electrically couples the ultrasound transducer array and the electronics.