Embedded EMV Transaction Card With Hidden Chip Contacts

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Solution Overview

Problem

EMV chip cards have an unattractive electrical connector on the front, leaving a space where card art cannot be included, and existing solutions do not effectively hide the chip or magnetic strip from view.

Innovation Solution

Transaction cards with a substrate containing a hidden EMV chip and magnetic strip, connected by conductive materials, and an optional antenna, which are embedded and not visible from the surface, allowing for secure and aesthetic design options.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the electrical connector is placed on the front of the card for chip reading, then the chip can be read by the card reader, but the connector is unattractive and prevents card art from being included in that space

Engineering Contradiction:
Improvecard design flexibilityVSAvoidconnector visibility
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The electrical connector is extracted from the front surface of the card and relocated to the back surface. This allows the front surface to be fully dedicated to aesthetic card art while the connector remains functional on the back, resolving the conflict between design flexibility and connector visibility.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The connector position is moved from the front surface (2D plane) to the back surface (another dimension/surface), effectively removing it from the visible design area while maintaining its electrical functionality for chip reading.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If the chip is embedded in the substrate, then the card design is more aesthetic, but the electrical connection between the chip and reading device becomes more complex

Engineering Contradiction:
Improveaesthetic designVSAvoidelectrical connection structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The electrical connector is extracted from the front surface and placed on the back, simplifying the front surface embedding while the connector handles the electrical connection complexity on the opposite side.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate acts as an intermediary that houses the chip internally while providing pathways for electrical connections to reach the connector on the back surface, enabling both aesthetic embedding and functional connectivity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the magnetic strip is hidden below the substrate surface, then the design is more attractive, but the reading device must access the strip from below

Engineering Contradiction:
Improvedesign attractivenessVSAvoidreading device access
Core Design Contradiction:
Ease of manufactureVSEase of operation

Solution Approach 1:

The magnetic strip is extracted from the front surface and relocated to the back surface of the substrate, allowing it to be hidden from the front view for aesthetic purposes while remaining accessible to reading devices that can approach from the back.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The magnetic strip is positioned on the back surface (another dimension), hiding it from the front view while maintaining accessibility for reading devices that can read from the back side of the card.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12608574B2Transaction cards
Publication Date: 2026.04.21 JPMORGAN CHASE BANK NA
  • US12608574B2 patent drawing
  • US12608574B2 patent drawing
  • US12608574B2 patent drawing

AI summary

Transaction cards are disclosed. In one embodiment, a transaction card may include: a substrate having a top surface and a bottom surface; a chip comprising a plurality of electrical contacts and positioned in the substrate below the top surface of the substrate; and a first conductive material provided between the plurality of electrical contacts and the top surface of the substrate, wherein the first conductive material provides an electrical connection to the chip such that the chip is readable by a chip reading device. The chip may not be visible from the top surface of the substrate.