Embedded Electrostatic Chuck With Isolated DC Feed for Leakage Control
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Solution Overview
Problem
Existing electrostatic chucks (ESCs) in semiconductor manufacturing suffer from high current leakage due to the integration of RF and DC inputs, leading to uncontrollable chucking forces, wafer damage, increased energy consumption, and elevated maintenance costs.
Innovation Solution
The implementation of an electrostatic chuck design where the DC input is electrically isolated from the RF feed, utilizing a ceramic plate with an embedded electrode and an insulating collar to prevent current leakage, allowing independent control of chucking and RF bias.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If RF feed and DC supply are provided through a single input, then device complexity is reduced, but current leakage increases
Solution Approach 1:
The single input structure is segmented into separate RF feed input and DC supply input paths. The DC supply connects to the electrode through an insulating collar that prevents current leakage to the chamber, while the RF feed connects to the conductive body. This segmentation resolves the contradiction by maintaining structural simplicity while eliminating the harmful current leakage effect.
Solution Approach 2:
An insulating collar is introduced as an intermediary component between the DC supply input and the conductive body. This collar acts as a mediator that allows DC current to reach the electrode for generating electrostatic chucking force while preventing the current from leaking into the plasma environment, thus resolving the current leakage problem without complicating the overall input structure.
2Ease of operation
If DC current flows through the conductive body, then electrode activation is simplified, but current leakage into plasma increases
Solution Approach 1:
The harmful current leakage path is extracted and removed from the system by introducing an insulating collar that blocks the leakage route. The DC current is directed exclusively through the electrode to generate chucking force, while the insulating collar prevents any current from reaching the plasma environment. This maintains ease of electrode activation while eliminating the harmful effect.
Solution Approach 2:
The insulating collar serves as a mediator that separates the DC current path from the conductive body and plasma environment. It allows the DC current to effectively activate the electrode for chucking while preventing current leakage into the plasma, thus resolving the contradiction between operational simplicity and current leakage prevention.
3Adaptability or versatility
If RF bias is applied through the conductive body, then RF feed integration is improved, but electrical isolation from DC supply is compromised
Solution Approach 1:
The electrical input paths are segmented into separate RF and DC channels. The RF feed connects to the conductive body for applying RF bias during plasma processing, while the DC supply connects to the electrode through an insulating collar. This segmentation maintains versatile RF feed integration while ensuring reliable electrical isolation between DC and RF paths, preventing current leakage and interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces current leakage, maintains consistent chucking forces, enhances energy efficiency, and minimizes wafer and ESC damage, thereby lowering operational costs and improving processing reliability.
Implementation Method 1
The ESC provides an electrostatic force that attracts the wafer to the chuck in order to prevent movement of the wafer during processing.
Implementation Method 2
processing the substrate in a plasma environment during application of an RF bias applied by the RF input
Data Source
AI summary
Embodiments disclosed herein may include an apparatus that includes a body with a first surface and a second surface opposite from the first surface. In an embodiment, the body is an electrically conductive material. A hole may be formed into the first surface of the body, and a ceramic plate may be on the second surface of the body. An electrically conductive electrode may be embedded in the ceramic plate. In an embodiment, the apparatus may further include a pin that is electrically conductive and positioned in the hole. The pin may be electrically isolated from the body, and the pin may be electrically coupled to the electrode embedded in the ceramic plate.