3D Printed Electronics Interconnects Using Embedded Filaments

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Solution Overview

Problem

Current additive manufacturing (AM) techniques for 3D structural electronics face limitations in reliability, performance, and cost due to low temperature cured conductive ink technologies, restricting their application to simple devices and lacking the mechanical strength and multi-layer capabilities of traditional printed circuit boards.

Innovation Solution

Embedding filaments or meshes within thermoplastic substrates during the fabrication of complex 3D structures, using methods like ultrasonic welding or electroplating, to enhance mechanical strength and create durable electrical interconnects comparable to traditional PCBs, while allowing for thermal management and improved mechanical properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conductive ink-based additive manufacturing is used to create 3D structural electronics, then manufacturing flexibility and 3D freedom are improved, but reliability and mechanical strength deteriorate

Engineering Contradiction:

Improve3D freedomVSAvoidreliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent uses composite materials by combining conductive ink with reinforcing elements such as metal particles, fibers, or meshes within the ink formulation. This creates a composite conductive trace that maintains the flexibility and 3D printing capability of ink-based manufacturing while significantly improving mechanical strength and reliability to match or exceed traditional PCB standards.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If low temperature cured conductive ink is used for 3D electronics manufacturing, then ease of manufacture is improved, but conductivity and durability worsen

Engineering Contradiction:

Improveease of manufactureVSAvoiddurability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent employs parameter changes by developing conductive inks with modified chemical compositions that enable curing at lower temperatures while achieving superior electrical conductivity and mechanical durability. This may involve using novel resin systems, catalysts, or particle formulations that reduce curing temperature requirements without sacrificing performance.

Inventive Principle:

Principle #35Parameter changes

3Manufacturing precision

If electroless plating is used to create conductive traces, then manufacturing precision is improved, but cross-sectional area and current capability worsen

Engineering Contradiction:

Improvemanufacturing precisionVSAvoidcross-sectional area

Core Design Contradiction:

Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent transitions from two-dimensional surface plating to three-dimensional embedded conductors by incorporating conductive materials directly into the bulk of the molded part during injection molding. This allows conductors to extend through the thickness of the part, providing much larger cross-sectional areas for high current capability while maintaining precise positioning through mold cavity design.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Reliability

If traditional PCB technology is used, then reliability and performance are improved, but adaptability to 3D structures and manufacturing flexibility worsen

Engineering Contradiction:

ImproveperformanceVSAvoidadaptability to 3D structures

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies segmentation by dividing the conductor formation process into discrete injection molding stages that can create conductors at different locations, orientations, and depths within three-dimensional structures. This segmented approach allows complex 3D interconnect architectures to be built layer-by-layer, maintaining PCB-level reliability while achieving the adaptability needed for genuine 3D electronics.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in 3D printed electronics with improved mechanical strength, reliability, and conductivity, enabling applications such as smart prosthetics, UAVs, and satellites, and addresses the limitations of existing AM technologies by creating commercially viable, mass-customized 3D printed electronics with enhanced market potential.

Implementation Method 1

using methods like ultrasonic welding or electroplating, to enhance mechanical strength and create durable electrical interconnects

Methodology Applied

Scientific EffectUltrasonic welding: Ultrasonic Vibration

Implementation Method 2

using methods like ultrasonic welding or electroplating, to enhance mechanical strength and create durable electrical interconnects

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10660214B2Methods for connecting inter-layer conductors and components in 3D structures

Publication Date: 2020.05.19 BOARD OF RGT THE UNIV OF TEXAS SYST

AI summary

Systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic, or electromechanical component/device.