Embedded IC Package Filters for Chip Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional mobile wireless devices face power inefficiencies due to power-hungry transmitters and receivers, which significantly impact battery life, especially as they operate in the tens of GHz range and require larger chip sizes for incorporating filters.
Innovation Solution
Embedding filter components such as lumped element capacitors, inductors, transformers, and distributed element devices within a multi-layer package bonded to the integrated circuit, utilizing metal and ferromagnetic layers, and employing flip-chip bonding to reduce chip real estate and improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If filters are incorporated on the integrated circuit chip, then filtering functionality is integrated, but chip size increases significantly
Solution Approach 1:
The filter components are segmented from the integrated circuit chip and placed on a separate multi-layer package. This segmentation allows the chip to maintain its compact size while the filter functionality is provided by the external package structure with metal and ferromagnetic layers.
Solution Approach 2:
The filter structure transitions from a two-dimensional planar layout on the chip to a three-dimensional multi-layer package structure. This dimensional change enables complex filtering functionality with multiple metal and ferromagnetic layers stacked vertically, reducing the horizontal footprint.
2Reliability
If conventional transmitters and receivers are used, then communication functionality is provided, but power consumption is high
Solution Approach 1:
The invention changes the physical parameters of the filter components by using ferromagnetic materials with specific permeability values and optimizing the geometry of metal layers. These parameter changes enable more efficient signal filtering with lower insertion loss, reducing the power required by the transmitter and receiver.
3Area of moving object
If filter components are placed on a multi-layer package, then chip real estate is reduced, but manufacturing complexity increases
Solution Approach 1:
Multiple filter components are merged into a single multi-layer package structure. The package combines metal layers, ferromagnetic layers, and interconnect structures into one integrated assembly that provides complete filtering functionality without requiring multiple separate components or complex interconnections.
Data Source
AI summary
Methods and systems for filters embedded in an integrated circuit package are disclosed and may include controlling filtering of signals within an integrated circuit via one or more filter components embedded within a multi-layer package bonded to the integrated circuit. The one or more filter components may be electrically coupled to one or more switchable capacitors within the integrated circuit. The filter components may include transmission line devices, microstrip filters, transformers, surface mount devices, inductors, and/or coplanar waveguide filters. The filter components may be fabricated utilizing metal conductive layers and/or ferromagnetic layers deposited on and/or embedded within the multi-layer package. The integrated circuit may be electrically coupled to the multi-layer package utilizing a flip-chip bonding technique.